Embedded Component Carrier Nesting for Delamination Prevention
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Solution Overview
Problem
Existing electronic devices with densely packed components face challenges in providing robustness and preventing delamination, especially in vertically stacked arrangements, where flexible component carriers are prone to mechanical stress and thermal expansion issues.
Innovation Solution
The solution involves embedding a first component carrier with an electronic component within a second component carrier, where the first carrier is surrounded by the second from at least three sides, providing mechanical protection and electrical connectivity through soldering, wire bonding, or adhesion, and using anisotropic conductive films for reliable connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If flexible component carriers are used in vertically stacked arrangements, then accommodation space for electronic components is increased, but delamination occurs due to mechanical stress and thermal expansion
Solution Approach 1:
The patent embeds a first component carrier within a second component carrier, creating a nested structure where the first carrier is surrounded by the second carrier from at least three sides. This nesting provides mechanical protection and prevents delamination while maintaining the compact 3D stacked arrangement for accommodating multiple electronic components.
Solution Approach 2:
The patent employs different material properties for the first and second component carriers, where the second carrier acts as a rigid protective structure surrounding the first carrier. This composite approach combines the flexibility needed for 3D stacking with the rigidity required to prevent delamination under mechanical stress and thermal expansion.
2Reliability
If rigid component carriers are used for stacked arrangements, then delamination is prevented, but flexibility and compact design are reduced
Solution Approach 1:
The patent uses nesting where a flexible first component carrier is embedded within a rigid second component carrier. This allows the inner carrier to maintain flexibility for compact 3D stacking while the outer carrier provides the rigidity needed to prevent delamination, thus resolving the contradiction between flexibility and reliability.
3Volume of moving object
If multiple component carriers are vertically stacked, then accommodation space is increased, but mechanical stress and thermal expansion issues arise
Solution Approach 1:
The patent embeds the first component carrier within the second component carrier, creating a protective nested structure that reduces mechanical stress on individual carriers and mitigates thermal expansion issues by providing a stable outer structure that constrains and protects the inner carriers in the vertically stacked arrangement.
Solution Approach 2:
The second component carrier acts as a protective structure that beforehand cushions and protects the first component carrier from mechanical stress and thermal expansion effects, preventing damage before it occurs in the densely packed 3D stacked configuration.
Data Source
AI summary
An electronic device having a first component carrier and an electronic component which is surface mounted on or embedded within the first component carrier. The electronic device further has a second component carrier. The first component carrier together with the electronic component is at least partially embedded within the second component carrier.