Embedded Component Circuit Boards with Grooved Side Connections
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Solution Overview
Problem
Existing embedded circuit boards face challenges in thinning due to the thickness of SMT solder paste and complexity in fixing electronic components from the side surface.
Innovation Solution
A method involving a wiring board with grooves and conductive pillars for embedding electronic components, using a mask to form grooves and fill them with conductive material to connect to conductive pillars, and forming outer wiring structures to encapsulate components, simplifying the process and reducing board thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If SMT solder paste is used to solder electronic components on the surface of the substrate, then the electronic components can be fixed on the circuit board, but the solder paste occupies certain thickness which is not conducive to the thinning of the circuit board
Solution Approach 1:
The patent transitions from surface mounting (2D plane) to side surface embedding (3D depth), allowing components to be fixed within the board thickness rather than adding to it. The component is positioned in a groove and soldered from the side, eliminating the need for thick solder paste on the surface.
Solution Approach 2:
The electronic component is nested within a groove formed in the circuit board substrate, with the component partially embedded into the board structure. This nesting approach allows the component to occupy space within the board rather than extending beyond the surface, reducing overall thickness.
2Length of stationary object
If other existing processes for fixing the electronic component inside the circuit board from the side surface are used, then the circuit board thickness can be reduced, but the process becomes more complicated
Solution Approach 1:
The manufacturing process is segmented into distinct, manageable steps: forming a groove, placing the component, filling with solder, and completing the circuit. This segmentation simplifies the overall complex process of side-surface embedding by breaking it down into standard, well-understood manufacturing operations.
Solution Approach 2:
The groove is formed in advance before component placement, preparing the substrate in advance to receive the component. This preliminary action simplifies the subsequent embedding process by pre-establishing the recessed space needed for component insertion and soldering.
Data Source
AI summary
A method for manufacturing a circuit board is provided, which includes a wiring board. The wiring board includes a first wiring layer, a dielectric layer and a second wiring layer stacked, and conductive pillars. Each conductive pillar connects the first wiring layer and the second wiring layer. A groove is recessed from a side of the dielectric layer facing away from the second wiring layer, and includes first recessed portion and second recessed portions recessed from a sidewall of the first recessed portion. An end surface of each conductive pillar is exposed from the at least two spaced second recessed portions, and a sidewall of each pillar close to the first recessed portion is exposed from the second recessed portion. An one electronic component is received in the first recessed portion, and is connected to the conductive pillars through electrical connecting portions received in the second recessed portions.