Component Carrier Layer Stack with Embedded Components

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Solution Overview

Problem

The challenge lies in efficiently manufacturing component carriers with embedded components that require effective heat removal and mechanical robustness, while maintaining electrical reliability, especially as electronic components become more miniaturized and densely packed, leading to issues with warpage and delamination.

Innovation Solution

A manufacturing method involving a layer stack of uncured component carrier material with components embedded in recesses, cured to form a robust dielectric structure on the surface, which includes a high-temperature dielectric redistribution layer for mechanical and electrical connectivity, using materials like polyimides and polybenzoxazole for thermal stability and rigidity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If electronic components are miniaturized and densely packed to increase functionality, then product functionality and component density are improved, but heat removal efficiency deteriorates and warpage/delamination issues worsen

Engineering Contradiction:

Improveproduct functionalityVSAvoidheat removal efficiency

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The patent divides the component carrier into a multi-layer structure with alternating layers of conductive material and dielectric material. This segmentation allows heat to be dissipated through multiple pathways and reduces thermal stress concentration, thereby improving heat removal efficiency while maintaining high component density

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent applies different material properties to different regions of the component carrier. High-thermal-conductivity materials are used in heat-generating areas, while low-CTE materials are used in regions prone to warpage. This localized optimization resolves the contradiction between high functionality and heat management

Inventive Principle:

Principle #3Local quality

2Adaptability or versatility

If electronic components are miniaturized and densely packed, then product functionality is improved, but mechanical robustness deteriorates due to warpage and delamination

Engineering Contradiction:

Improveproduct functionalityVSAvoidmechanical robustness

Core Design Contradiction:

Adaptability or versatilityVSStrength

Solution Approach 1:

The patent employs composite material structures combining multiple dielectric layers, conductive layers, and reinforcement elements. This composite approach enhances mechanical strength and dimensional stability while accommodating high component density, resolving the contradiction between functionality and mechanical robustness

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

Instead of trying to prevent warpage through rigid constraints, the patent inverts the approach by designing a flexible multi-layer structure that can accommodate thermal expansion differences. The alternating conductive and dielectric layers create a balanced structure that naturally resists warpage through internal stress compensation

Inventive Principle:

Principle #13The other way round (Inversion)

3Ease of manufacture

If conventional dielectric materials are used in manufacturing, then ease of manufacture is improved, but reliability deteriorates under high temperature conditions

Engineering Contradiction:

Improvemanufacturing easeVSAvoidhigh temperature reliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent changes the thermal parameters of the dielectric materials by selecting materials with specific glass transition temperatures and thermal expansion coefficients matched to the conductive layers. This parameter optimization ensures reliability under high temperature conditions while maintaining manufacturability through standard fabrication processes

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables efficient, high-throughput manufacturing of component carriers with enhanced thermal robustness, reduced warpage and delamination, and improved mechanical and electrical reliability, suitable for harsh conditions and high-temperature processes.

Implementation Method 1

integrally connecting the components with the layer stack by curing the component carrier material

Methodology Applied

Scientific EffectCuring: Chemical Bonding

Data Source

PatentUS10863631B2Layer stack of component carrier material with embedded components and common high temperature robust dielectric structure

Publication Date: 2020.12.08 AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AG

AI summary

A manufacturing method, wherein the method includes providing a layer stack having at least partially uncured component carrier material, arranging a plurality of components in recesses of the layer stack, integrally connecting the components with the layer stack by curing the component carrier material, and applying a high temperature robust dielectric structure on a main surface of the cured layer stack with the components therein.