Embedded Component Package Structure for Compact Semiconductor Design
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Solution Overview
Problem
The challenge is to reduce the size of semiconductor components while maintaining their functionality and heat dissipation capabilities, as traditional packaging methods occupy significant surface area on substrates and complicate manufacturing processes.
Innovation Solution
An embedded component package structure is developed, where a semiconductor die is embedded within a substrate with through holes and conductive layers, allowing for reduced size and enhanced heat dissipation through a metal layer directly on the die's back surface, along with a dielectric layer and conductive interconnections, facilitating efficient electrical connections and shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If traditional packaging methods are used, then electrical connectivity is achieved, but the surface area occupied is significant and size reduction is limited
Solution Approach 1:
The semiconductor die is embedded within a through-hole of the substrate, nesting the die inside the substrate structure rather than placing it on the surface. This allows the package to occupy less surface area while maintaining all necessary electrical and mechanical connections through the substrate thickness.
Solution Approach 2:
The package structure transitions from a two-dimensional surface mounting approach to a three-dimensional embedded approach. Electrical connections are established through vertical via holes penetrating the substrate, utilizing the depth dimension to reduce surface footprint while maintaining connectivity.
2Area of moving object
If component size is reduced, then surface area is saved, but heat dissipation capability may be compromised
Solution Approach 1:
A metal layer is introduced as an intermediary thermal management component directly on the back surface of the die. This metal layer acts as a heat spreader or heat sink interface, efficiently conducting heat away from the die without requiring additional surface area, thus maintaining small package size while improving heat dissipation.
3Reliability
If more conductive layers and through holes are added for electrical connectivity, then electrical connection reliability improves, but manufacturing complexity increases
Solution Approach 1:
The electrical connection path is segmented into distinct functional layers: substrate conductive layers for signal routing, via holes for vertical interconnection, and metal layers on the die back surface for bonding. This segmentation allows each layer to be optimized independently while ensuring reliable electrical connectivity throughout the embedded structure.
Data Source
AI summary
An embedded component package structure includes a substrate. A first conductive component extends from a first surface of the substrate to a second surface of the substrate, a first conductive layer is disposed on the first surface of the substrate, and a second conductive layer is disposed on the second surface of the substrate and is electrically connected to the first conductive layer by the first conductive component. A die is disposed in a through hole in the substrate. A back surface of the die is exposed from the second surface of the substrate. A first dielectric layer covers an active surface of the die and the first surface of the substrate. A third conductive layer is disposed on the first dielectric layer and is electrically connected to the die by a second conductive component. A first metal layer is disposed directly on the back surface of the die.