Embedded Component Pad Rearrangement for Via Reliability
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Solution Overview
Problem
The miniaturization of electronic components, particularly active elements like IC chips, has led to reduced contact pad areas and increased complexity in electrical connections, resulting in decreased connection reliability and efficiency during the embedding process, especially when forming vias through insulating layers.
Innovation Solution
The embedded electronic component design includes a contact pad covered by a first insulating layer, a first pad, a rearrangement portion, and a second pad with a larger exposed area, allowing for improved connection reliability by electrically connecting external wiring to the second pad, which is connected to the contact pad through the first pad and rearrangement portion, and is manufactured using a method involving multiple insulating layers and via formation in these layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the area of contact pad and interval between contact pads are reduced to make electronic components smaller, then the size of electronic component is reduced, but the connection reliability in via-hole formation and plating process is greatly reduced
Solution Approach 1:
The patent divides the contact pad structure into multiple segments: the original contact pad on the active element, an intermediate pad on the insulating layer, and a final pad with larger area for via connection. This segmentation allows each part to serve its specific function - the contact pad maintains electrical connection to the active element, the intermediate pad provides transition, and the final pad ensures reliable via connection, thereby resolving the contradiction between miniaturization and connection reliability
Solution Approach 2:
The patent extends the connection path from a single-plane contact pad to a multi-layer structure by adding pads on the insulating layer surface. This dimensional extension allows the via to connect to a larger area pad on the insulating layer rather than directly to the small contact pad, effectively increasing the connection area in the vertical dimension while maintaining the compact footprint of the active element
2Length of moving object
If the area of contact pad and interval between contact pads are reduced, then the thickness and area of active element are reduced, but the process of electrically connecting contact pads to external device becomes more difficult
Solution Approach 1:
The patent introduces intermediate pads on the insulating layer as mediator structures between the small contact pad on the active element and the external via connections. These intermediate pads serve as transition elements that facilitate the electrical connection process by providing larger target areas for via formation and plating, thereby making the manufacturing process easier despite the reduced size of the active element
3Quantity of substance
If contact pads are made smaller and closer together, then electronic devices can be made slimmer, but there is great reduction in connection reliability in via-hole formation or plating process
Solution Approach 1:
The patent performs preliminary action by forming pads on the insulating layer surface before via-hole formation. These pre-formed pads provide defined, larger area targets for subsequent via-hole formation and plating processes, thereby improving manufacturing precision and reducing the difficulty of via formation even when contact pads are made smaller and closer together
Data Source
AI summary
Disclosed is an embedded electronic component which can improve reliability of connection with external wiring and efficiency of an embedding process by including: a contact pad provided on at least one surface of a body portion and made of a conductive material; a first insulating layer for covering the at least one surface of the body portion; a first pad in contact with a surface of the contact pad and made of a conductive material; a rearrangement portion provided on a surface of the first insulating layer to be in contact with the first pad; a second pad provided on the surface of the first insulating layer to be in contact with the rearrangement portion; and a second insulating layer having an opening to expose a portion of the second pad while covering the first insulating layer, the first pad, the rearrangement portion, and the second pad.