Embedded Component Structure Wiring Board Process Yield
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Solution Overview
Problem
The process yield of embedding components into wiring boards is reduced due to the fabricating process, which affects the production of user-friendly and high-performance electronic products that require compactness and reduced wiring board area.
Innovation Solution
An embedded component structure is developed, comprising a wiring board with an opening and an interconnection layer, where a normal-function component is bonded to the board and an encapsulant is filled to cover the component, exposing its working area, thus enhancing the process yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the component is embedded during the fabricating process of the wiring board, then the wiring board area is reduced and compactness is improved, but the process yield is reduced
Solution Approach 1:
The component is bonded to the wiring board at an earlier stage before final encapsulation, allowing the component to be positioned and electrically connected while the board is still being fabricated. This preliminary bonding action enables subsequent encapsulation without compromising the component's electrical functionality, thereby maintaining process yield while achieving compact embedded design
Solution Approach 2:
The fabrication process is segmented into distinct stages: first bonding the component to the wiring board, then performing encapsulation in a separate subsequent step. This segmentation allows each process to be optimized independently, ensuring that the component bonding maintains electrical functionality while the encapsulation provides protection, thus resolving the contradiction between area reduction and process yield
2Volume of moving object
If the component is embedded in the wiring board, then the electronic product becomes more compact and lightweight, but the manufacturing complexity increases
Solution Approach 1:
The component bonding process is merged with the existing wiring board fabrication process flow, utilizing available bonding equipment and processes already present in the manufacturing line. This merging approach embeds the component during normal fabrication without requiring entirely new manufacturing equipment or processes, thereby reducing the increase in manufacturing complexity while achieving compact product design
Data Source
AI summary
A wiring board is provided, wherein electrical function of the wiring board is normal, the wiring board has a front side, a reverse side opposite to the front side, an opening and an interconnection layer, the opening penetrates the wiring board and connects the front side and the reverse side, and the interconnection layer is located on the front side and extends toward the opening. A component is bonded to the wiring board, wherein electrical function of the component is normal, the component has an active surface, a back surface opposite to the active surface, and a working area located on the active surface, the active surface is bonded to the interconnection layer, the component is located in the opening, and the active surface and the front side of the wiring board face in a same direction. An encapsulant is filled into the opening, so as to cover the component and expose the working area.