Embedded Electronic Components in Thick-Core Substrates
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Solution Overview
Problem
Existing methods for embedding electronic components in substrates, particularly those with thick cores, face challenges in maintaining proper alignment and securing the components due to gaps and resin filling issues, leading to potential delamination and manufacturing difficulties in larger substrates.
Innovation Solution
A method involving a core dielectric with a conductive pattern, a metallization structure, and an adhesive layer to secure electronic components within openings in the dielectric, ensuring proper alignment and resin filling to maintain electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic components are embedded in thick-core substrates using conventional methods, then manufacturing complexity increases due to alignment and resin filling issues, but component embedding reliability deteriorates due to delamination risks
Solution Approach 1:
The patent applies preliminary action by forming protrusions on the core surface before mounting electronic components. These protrusions are created in advance to provide mechanical interlocking features that prevent delamination. The adhesive material is also applied preliminarily to fill gaps between components and substrate, ensuring proper filling before final curing, which eliminates the need for complex post-processing alignment adjustments.
Solution Approach 2:
The patent implements local quality by creating localized protrusions at specific mounting positions rather than uniformly modifying the entire core surface. The adhesive material is selectively applied to gap regions between electronic components and the substrate, providing targeted reinforcement only where delamination risks exist. This localized approach simplifies manufacturing compared to global modifications while maintaining reliability.
2Adaptability or versatility
If conventional embedding methods are used for various package substrates, then adaptability to different packaging tasks is limited, but manufacturing process standardization is reduced
Solution Approach 1:
The patent achieves universality by designing a core structure with standardized protrusion features that can accommodate different types and sizes of electronic components. The same core fabrication process with protrusions can be applied across various package substrate types (e.g., different thicknesses, materials), allowing a single manufacturing methodology to serve multiple packaging tasks. The adhesive filling approach also universally addresses gap issues regardless of component configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for reliable embedding of electronic components in thick-core substrates, addressing alignment and resin filling challenges, thereby enhancing manufacturing efficiency and reducing delamination risks.
Implementation Method 1
a first adhesive layer coupling the first electronic component with the core
Data Source
AI summary
In an aspect, a substrate includes a core that includes a core dielectric and a first conductive pattern on a first surface of the core dielectric, and a first metallization structure over the first surface of the core dielectric. The first metallization structure includes a first dielectric, and the first dielectric has a first opening formed therein. The substrate further includes a first electronic component disposed in the first opening of the first dielectric, and a first adhesive layer coupling the first electronic component with the core.