Embedded Connection Units for Thin Package Stacking
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Solution Overview
Problem
Existing semiconductor package stacking technologies face challenges in achieving a small thickness due to the need for space reserved for solder balls, which increases the height of the interconnection structure and can degrade the reliability of connections between packages.
Innovation Solution
A package stacked device is designed with a first and second packaging body layer, each containing a semiconductor chip, where a first connection unit from the first package is connected to a second connection unit from the second package using a first adhesive layer, eliminating the need for solder balls and reducing the overall thickness by integrating the connection units directly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder balls are used for interconnection between packages, then reliable electrical connection is achieved, but the thickness of the package stacked device increases
Solution Approach 1:
The patent extracts and eliminates the solder ball component from the interconnection structure. Instead of using traditional solder balls that protrude from the package bottom, the invention uses connection units that are directly embedded in the packaging body layer, removing the need for separate solder balls and reducing the overall thickness required for interconnection.
Solution Approach 2:
The patent merges the connection unit with the packaging body layer by embedding the connection unit directly into the packaging material. This integration eliminates the need for separate solder ball components and reduces the overall thickness of the stacked device while maintaining reliable electrical connections between packages.
2Reliability
If solder balls are used for interconnection, then electrical connection between packages is established, but the height of the interconnection structure increases
Solution Approach 1:
The connection unit is merged with the packaging body layer through direct embedding, eliminating the need for protruding solder balls. This integration significantly reduces the height of the interconnection structure while maintaining reliable electrical connections between stacked packages.
Solution Approach 2:
The patent transitions from a three-dimensional protruding solder ball structure to a more compact embedded connection structure. By changing the dimensional arrangement of the connection unit from external protrusion to internal embedding, the interconnection height is reduced while maintaining connectivity.
3Stability of the object's composition
If space is reserved for solder balls, then proper spacing between packages is maintained, but the overall device thickness increases
Solution Approach 1:
The connection unit is embedded within the packaging body layer itself, merging the connection function with the structural packaging material. This eliminates the need for additional space reserved for external solder balls, reducing device thickness while maintaining proper package spacing through the embedded connection structure.
4Productivity
If traditional POP technology with solder balls is used, then package stacking is achieved, but manufacturing complexity increases
Solution Approach 1:
The connection unit is integrated into the packaging body layer through embedding, merging multiple functions (structural support, electrical connection, and spacing) into a single unified structure. This simplification reduces manufacturing complexity compared to traditional POP technology that requires separate solder ball attachment processes.
Solution Approach 2:
The embedded connection unit serves multiple functions simultaneously: it provides electrical connection between packages, maintains structural integrity of the packaging, and ensures proper spacing. This multi-functionality reduces the number of separate components and processes needed, simplifying manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for a package stacked device with a reduced thickness, enhanced reliability of connections, and the ability to stack multiple packages within a limited height, addressing the limitations of traditional solder ball-based interconnection methods.
Implementation Method 1
a first adhesive layer substantially covering the exposed top surface of the second connection unit within the first opening. The first connection unit may be inserted into the first opening and connected to the first adhesive layer.
Data Source
AI summary
A package stacked device may include a first packaging body layer having a first chip embedded therein, and a second packaging body layer positioned under the first packaging body layer and having a second chip embedded therein. The package stacked device may also include a first connection unit protruding from a first bottom surface of the first packaging body layer, a second connection unit protruding from a second top surface of the second packaging body layer, a first covering layer providing a first opening to expose the top surface of the second connection unit and substantially covering the second top surface of the second packaging body layer, and a first adhesive layer substantially covering the exposed top surface of the second connection unit within the first opening. The first connection unit may be inserted into the first opening and connected to the first adhesive layer.