Embedded Active Cooling Chip for Opticondistor Thermal Management
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Solution Overview
Problem
Existing electronics assemblies face challenges in achieving enhanced thermal performance and device alignment due to bottlenecks in metal and ceramic packaging layers, especially in high-power applications with increasing power density, and require an improved strategy for compact packaging that effectively manages heat and maintains alignment of light sources with photonic cores in opticondistors.
Innovation Solution
The integration of an embedded active cooling chip with metallization layers, fluid inlets and outlets, and micro-channels within the semiconductor material, allowing for efficient heat dissipation through a cooling fluid while maintaining alignment of the light source with the photonic cores, which are made of wide band gap semiconductor materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional metal and ceramic packaging layers are used for cooling electronics devices, then the device structure is simple and manufacturing is easier, but thermal performance becomes a bottleneck as power density increases
Solution Approach 1:
The patent merges the cooling function directly into the substrate by integrating micro-channels within the substrate material itself, eliminating the need for separate metal and ceramic packaging layers. This integration resolves the technical contradiction by achieving enhanced thermal performance through internal micro-channels while avoiding the complexity of multi-layer packaging structures.
Solution Approach 2:
The patent transitions from traditional planar cooling approaches to three-dimensional micro-channels embedded within the substrate. This dimensional change allows cooling fluid to flow through the interior of the substrate, providing superior thermal management capability without increasing external package complexity.
2Productivity
If compact packaging is implemented to improve device integration, then device density increases, but alignment of light source with photonic core becomes more difficult
Solution Approach 1:
The patent combines the light source, photonic core, and cooling micro-channels into a single integrated substrate structure. This merging enables compact packaging while maintaining precise alignment because all components are fabricated together in the same substrate using the same manufacturing processes, eliminating alignment issues that arise from assembling separate components.
Solution Approach 2:
The patent performs preliminary alignment by fabricating the light source and photonic core in predetermined positions within the substrate before final assembly. This preliminary positioning ensures precise alignment is achieved through the manufacturing process itself rather than requiring post-fabrication adjustment, enabling compact packaging without sacrificing alignment precision.
3Power
If power density is increased to improve device performance, then device capability increases, but heat dissipation becomes more challenging
Solution Approach 1:
The patent addresses heat dissipation challenges by transitioning from surface-level cooling to three-dimensional internal cooling through micro-channels embedded within the substrate. This dimensional change allows heat to be extracted from the interior where it is generated, enabling higher power density operations without compromising heat dissipation capability.
Solution Approach 2:
The patent employs hydraulic cooling by circulating fluid through the micro-channels to remove heat generated by high-power operations. This hydraulic cooling system efficiently manages heat dissipation for high power density applications, resolving the contradiction between increased power capability and heat removal challenges.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables reliable and efficient cooling of opticondistors, enhancing thermal performance and maintaining alignment for high-power applications, allowing for the use of opticondistors in high-voltage operations beyond the limits of conventional semiconductor devices.
Implementation Method 1
The first cooling chip includes at least one metallization layer on a portion of a first surface of the first cooling chip, at least one inlet through a second surface of the first cooling chip, wherein the second surface is opposite to the first surface, at least one outlet through the second surface of the first cooling chip, and one or more micro-channels extending between and fluidly coupled to the at least one inlet and the at least one outlet
Implementation Method 2
One example is an opticondistor, which includes a photonic core that uses a wide band gap (WBG) semiconductor material that exhibits photoconductivity and allows a current flow therethrough when light is incident on it
Data Source
AI summary
An electronics assembly includes a first cooling chip made of a semiconductor material, and at least one subassembly mounted on the first cooling chip. The first cooling chip includes at least one metallization layer on a portion of a first surface of the first cooling chip, at least one inlet through a second surface of the first cooling chip, wherein the second surface is opposite to the first surface, at least one outlet through the second surface of the first cooling chip, and one or more micro-channels extending between and fluidly coupled to the at least one inlet and the at least one outlet. The at least one subassembly includes one or more photonic cores positioned to receive light from a light source, wherein the one or more photonic cores comprise a wide band gap semiconductor material.