Embedded Cooling Structure for Stacked Memory Heat Dissipation
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Solution Overview
Problem
Microfluidic cooling systems face limitations in structural stability and heat transfer efficiency, particularly in 2.5-D/3-D ICs systems, where vertical heat dissipation is challenging and the thickness restricts application to only stable structures like application processors and interposers.
Innovation Solution
A semiconductor package design incorporating an interposer with stacked memory dies, through pipes for cooling liquid flow, and thermal transmission lines that extend horizontally to enhance heat transfer, allowing for improved cooling efficiency across the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a microfluidic cooling system with built-in cooling structure is used, then cooling efficiency is improved, but structural stability deteriorates due to the thin structure of several hundreds of micrometers
Solution Approach 1:
The cooling structure is nested within the semiconductor package by integrating through pipes through the memory dies and interposer, with thermal transmission lines embedded within the memory dies. This nested configuration allows the thin cooling structure to be supported by the surrounding package components, maintaining structural stability while preserving cooling efficiency.
Solution Approach 2:
The interposer serves as an intermediary structural element that supports the thin cooling structure. The through pipes pass through the interposer and connect to the memory dies, providing mechanical support and structural stability to the otherwise fragile microfluidic cooling system.
2Temperature
If cooling structure moves fluid inside the semiconductor chip, then heat transfer is improved, but manufacturing process stability deteriorates
Solution Approach 1:
The through pipes and thermal transmission lines are formed during the semiconductor manufacturing process before the memory dies are stacked. The cooling channels are pre-formed in the memory dies and interposer, allowing subsequent assembly steps to proceed without compromising manufacturing stability, while still enabling effective heat transfer when the system is operational.
3Stability of the object's composition
If underfill section is provided for each layer in 2.5-D/3-D ICs system, then structural support is improved, but vertical heat transfer deteriorates due to low heat transfer in vertical direction
Solution Approach 1:
The patent transitions from relying solely on vertical heat transfer through underfill sections to incorporating horizontal heat transfer pathways. Thermal transmission lines extend horizontally from the through pipes toward the second side surface of the memory dies, providing an additional dimension for heat dissipation that compensates for the limited vertical heat transfer capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively improves heat transfer performance by circulating cooling liquid through the package, addressing structural stability and vertical heat dissipation challenges, thereby enhancing the overall cooling efficiency of semiconductor devices.
Implementation Method 1
at least one first through pipe passing through the electronic device in the vertical direction adjacent to the first side surface, the first through pipe moving a cooling liquid therein
Implementation Method 2
the first through pipe moving a cooling liquid therein
Implementation Method 3
a plurality of thermal transmission lines extending in a horizontal direction in the memory die, the thermal transmission lines extending parallel with each other from the first through pipe toward the second side surface
Data Source
AI summary
A semiconductor package includes an interposer, an electronic device having a first side surface and a second side surface opposite to the first side surface, and including a plurality of memory dies stacked in a vertical direction, at least one first through pipe passing through the electronic device in the vertical direction adjacent to the first side surface, and moving a cooling liquid therein, and a plurality of thermal transmission lines extending in a horizontal direction inside the memory die, and extending in parallel from the first through pipe toward the second side surface.