Embedded Core Frame Package Structure for HPC Warpage Control

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Solution Overview

Problem

High-Performance Computing (HPC) packages experience significant warpage due to increased size, which is mitigated by thickening package substrates, leading to longer electrical paths and IR drop degradation.

Innovation Solution

Incorporating a core frame that provides mechanical support without conductive through-holes, maintaining electrical routing integrity by placing it at the same level as the package components, thus reducing warpage without increasing electrical path lengths.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If the thickness of package substrates is increased to control warpage, then warpage resistance is improved, but electrical path length increases causing IR drop degradation

Engineering Contradiction:

Improvewarpage resistanceVSAvoidelectrical path length

Core Design Contradiction:

Stability of the object's compositionVSLength of moving object

Solution Approach 1:

The package substrate is divided into two functional parts: a thick core frame structure (providing warpage resistance) and thin substrate regions (maintaining short electrical paths). The core frame has a thickness of 20-50 micrometers while the substrate regions adjacent to the package component have a thickness of 5-15 micrometers, allowing each region to optimize its function independently.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different thicknesses are applied to different regions of the package substrate. The core frame region has increased thickness for mechanical stability and warpage control, while the regions closer to the package component maintain reduced thickness to minimize electrical path length and IR drop. This local differentiation resolves the contradiction between structural stability and electrical performance.

Inventive Principle:

Principle #3Local quality

2Stability of the object's composition

If a thick core frame is used to provide mechanical support, then warpage is reduced, but electrical routing path length increases

Engineering Contradiction:

Improvewarpage controlVSAvoidelectrical routing path

Core Design Contradiction:

Stability of the object's compositionVSLength of stationary object

Solution Approach 1:

The substrate structure is segmented into a core frame portion and substrate regions. The core frame (20-50 micrometers thick) provides the mechanical support needed for warpage control, while the substrate regions (5-15 micrometers thick) maintain short electrical routing paths. This segmentation allows the thick frame to provide support without forcing electrical routes through the entire thickness.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The substrate regions act as intermediaries between the package component and the core frame. These thinner regions provide efficient electrical routing paths while the core frame provides mechanical support, allowing electrical signals to reach their destinations without traversing the full thickness of the thick frame structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS20250357231A1Warpage control of packages using embedded core frame

Publication Date: 2025.11.20 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A method includes placing a package component over a carrier. The package component includes a device die. A core frame is placed over the carrier. The core frame forms a ring encircling the package component. The method further includes encapsulating the core frame and the package component in an encapsulant, forming redistribution lines over the core frame and the package component, and forming electrical connectors over and electrically coupling to the package component through the redistribution lines.