Embedded-Die Coreless Substrate Stiffener Layers
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Solution Overview
Problem
Current semiconductor microelectronic device packaging technologies face challenges in efficiently processing and integrating embedded-die coreless substrates with high throughput and precise structural integrity, particularly in forming robust and compact packages with adequate stiffness for diverse applications.
Innovation Solution
The process involves forming an embedded-die coreless substrate with a ball-grid pad array, using a combination of etch-stop layers, adhesion release layers, and stiffener layers to achieve structural integrity and stiffness, while enabling efficient separation and assembly into larger systems, employing techniques like back-to-back mating and build-up layers to enhance processing throughput and form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional packaging technologies are used for embedded-die coreless substrates, then processing and integration can be performed with conventional methods, but processing efficiency is low and structural integrity is insufficient
Solution Approach 1:
The substrate is divided into multiple functional layers including etch-stop layers, adhesion release layers, stiffener layers, and dielectric layers. Each layer serves a specific function to collectively achieve both high processing efficiency and structural integrity. The segmentation allows for specialized optimization of each layer for its intended purpose.
Solution Approach 2:
The patent employs composite material structures combining different materials with complementary properties. The stiffener layers use materials with high modulus of elasticity to provide structural support, while etch-stop layers use materials that facilitate precise separation. This composite approach enables simultaneous achievement of mechanical strength and processing efficiency.
2Strength
If thicker substrate materials are used to increase stiffness, then structural integrity improves, but package size increases and compactness is reduced
Solution Approach 1:
Instead of uniformly thickening the entire substrate, stiffener layers are strategically placed in specific locations where structural support is most needed. This localized reinforcement provides maximum stiffness with minimum material usage, maintaining compact package size while achieving required structural integrity.
Solution Approach 2:
The patent introduces stiffener layers as a vertical dimension solution rather than increasing horizontal dimensions. By adding thickness selectively in the Z-direction at critical locations, the substrate achieves higher stiffness without proportionally increasing overall package volume, thus maintaining compactness.
3Productivity
If more separation layers are added to improve separation efficiency, then processing throughput increases, but device complexity increases
Solution Approach 1:
The etch-stop layers are designed to serve multiple functions: they act as separation interfaces for efficient die separation, provide structural support during processing, and enable precise alignment. This multi-functionality achieves high separation efficiency without adding dedicated separate components, thus avoiding increased device complexity.
Solution Approach 2:
The etch-stop layers function as intermediary structures that facilitate the separation process. These layers are specifically designed to be selectively removed or separated, acting as a mediator between the substrate and the separation process, thereby improving throughput without requiring complex separation mechanisms.
4Ease of manufacture
If conventional substrate designs are used, then manufacturing processes are simpler, but adequate stiffness for diverse applications is not achieved
Solution Approach 1:
Stiffener layers are incorporated into the substrate structure during the initial manufacturing process rather than as a post-processing step. This preliminary action ensures that structural reinforcement is built-in from the start, achieving adequate stiffness for diverse applications while maintaining manufacturing simplicity through integration into existing process flows.
Data Source
AI summary
An apparatus includes a coreless substrate with an embedded die that is integral to the coreless substrate, and at least one device assembled on a surface that is opposite to a ball-grid array disposed on the coreless substrate. The apparatus include an at least one stiffener layer that is integral to the coreless substrate and the stiffener layer is made of overmold material, underfill material, or prepreg material.