Printed Circuit Assembling TRIZ Cases

A workpiece holding body swings around a lateral axis to align mounting surfaces for viscous substance printing.

Segmented solder pads with non-wettable regions prevent capillary tilting and short circuits in optoelectronic assemblies.

Integral stiffener layers in coreless substrates maintain structural integrity while enabling efficient processing throughput.

A dual-sided lighting device mounts LED modules on opposing heat sinks to radiate light in distinct directions for flexible illumination.

Perforated nozzle plate segments direct molten solder flow to maintain a parallel wave front across the circuit board width.

Platinum group element oxide promotes silver sintering while glass frit bonds the layer to substrates, resolving solder heat resistance and adhesion trade-offs.

Attaching hard members with superior surface flatness to the press plate ensures even pressure distribution across elements, preventing mounting malfunctions.

Directly mating signal contacts to circuit board pads eliminates intermediate card edge connectors, reducing surface area and manufacturing cost.

Segmented shield layer uses conductive mesh near connection points to enable heat transfer during solder bonding.

An extrusion member lifts an inner lid to separate paste from a through hole, preventing drip during screen printing operations.

Adhesive fills the component recess before embedding, eliminating cavities that cause delamination during layer buildup.

A foil-like electrical connector joins solar cells using a conductive comb structure on an insulating carrier film for precise alignment.

Relocating battery electrode connections to the protection circuit module PCB edge frees the major face for component mounting.

A concaved area in the circuit board base guides melted flux away from conductive patterns.

A heating and cooling device uses induction heating with a transfer apparatus to adjust distance between the workpiece and cooling unit.

A laminated wiring connection structure uses a conductive adhesive layer and cover member to bond elastomer wires securely.

Solder flow outlets on a printed circuit board guide light emitting diodes into precise positions, resolving positioning errors caused by soldering shifts.

A single-layer projected capacitive touch panel uses an insulating ink layer with through slots to connect conductive wires.

A resin multilayer substrate design uses conductive pattern length variation to enhance adhesion strength between copper foils and resin layers.

A coverlay seals rigid and flexible insulating layers to prevent foreign material ingress at the interface.

Electroplated platinum rivets join hermetic electronics to flexible circuits, eliminating toxic solder corrosion in saline environments.

Laser welding replaces epoxy curing to secure a lens device onto a PCB frame, eliminating manual alignment errors and reducing manufacturing cycle time.

Two-step reflow and underfill reduce warpage and mechanical stress in stacked semiconductor devices during manufacturing.

Stacked conductive layers in a flexible PCB increase current capacity without expanding the track footprint.

A multilayer circuit board structure uses a hollow space between patterned layers to enable hybrid bonding and customizable dielectric properties.

A vehicle electronic control unit housing uses a connector cover flange to contain a potting layer that seals the assembly.

Replacing traditional dielectric films with adhesive layers reduces production costs while maintaining module stiffness and connection reliability.

Localized photonic heating bonds high-temperature solder while shielding sensitive components from excessive thermal exposure.

Mounting passive devices on the underside of a carrier substrate creates direct electrical pathways to external circuitry.

Positioning electrical terminals inside via arrays improves signal quality and reduces noise in dense high-speed PCB designs.

Lateral arrangement of the terminal member eliminates vertical stacking, reducing overall device thickness while maintaining structural integrity.

A base with a hollow space fastens signal input elements to circuit boards via protruding connection elements.

Bonding a second substrate with an opening exposes contacts for direct chip connection, reducing chip package thickness and increasing circuit layout space.

Metal mask injection deposits polyimide resin onto ceramic substrates, replacing spin-coating to solve uniformity issues on large heavy panels.

An embedded solder preform maintains a standoff gap between components and pads, allowing trapped gases to escape during reflow soldering.

A package substrate embeds large passive components inside a dielectric cavity to reduce Z-height and enable tighter placement.

A method bonding electronic components to oxidized solder surfaces using phase-transition adhesives for secure attachment.

An exhaust path removes welding gas from the contact portion, preventing contamination of the irradiation lens and stabilizing laser beam performance.

Peeling layer on support board matches semiconductor thermal expansion to reduce electrode pad pitch shift during manufacturing.

A wiring substrate integrates a filling member between connection terminals to prevent solder flow.

Continuous adhesive beads form channels directing corrosive aqueous cleaner solutions away from internal conductors during washing processes.

A piezoelectric resonator manufacturing method uses overlaying metallic films to achieve precise frequency tuning without complex positioning.

Laser welding a contact sleeve to a semiconductor carrier reduces thermal damage while ensuring mechanical stability.

Forming passive devices directly on a wiring substrate wafer using micromachining to create integrated electronic modules with reduced footprint.

A package structure embeds electronic components using a bonding carrier and wiring layers to eliminate hard boards.

A semiconductor package with an isolation region on the printed circuit board to increase contact area between molding layers.

A semiconductor lid applies force to bow its center away from the chip, creating compressive stress in the thermal interface material.

Reversible solder joints detach the lens assembly from the PCB without damage, preventing substrate destruction during maintenance.