Embedded Component Package Structure Without Hard Board

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Solution Overview

Problem

Conventional chip-size package structures require a hard board, leading to increased package thickness, size, cost, and reduced production efficiency due to the need for a hard board and adhesive attachment of electronic components.

Innovation Solution

A package structure with an embedded electronic component is fabricated using a bonding carrier without a hard board, where a first wiring layer is formed, an encapsulating layer is created with holes to expose the wiring layer, and a second wiring layer is added to fill these holes and connect electrically with the first wiring layer, eliminating the need for a hard board and adhesive.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a hard board is used as a carrier in the package structure, then the electronic components can be attached and supported, but the package thickness and overall size increase

Engineering Contradiction:

Improvecomponent attachment reliabilityVSAvoidpackage thickness

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The patent extracts and removes the hard board from the package structure, replacing it with a bonding carrier that directly supports the electronic components. This elimination of the hard board layer directly reduces package thickness while maintaining component attachment functionality through the bonding carrier and adhesive layer configuration.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent employs thin film structures including the bonding carrier, adhesive layers, and encapsulating layer to provide structural support and component attachment. These thin film alternatives replace the thick hard board, achieving both mechanical support and reduced thickness through the layered film structure.

Inventive Principle:

Principle #30Flexible shells and thin films

2Reliability

If a hard board and chip adhering film are used to attach electronic components, then components can be securely mounted, but manufacturing cost increases

Engineering Contradiction:

Improvecomponent attachment reliabilityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges the functions of the hard board and chip adhering film into an integrated bonding carrier structure with built-in adhesive layers. This consolidation eliminates the need for separate hard board and adhering film materials, reducing material costs and simplifying the manufacturing process while maintaining secure component mounting.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The bonding carrier serves multiple functions simultaneously: it provides structural support, enables component attachment through integrated adhesive layers, and facilitates electrical connections. This multi-functional design replaces the need for separate hard board and adhering film components, reducing overall manufacturing cost.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If a hard board and chip adhering film are used for component attachment, then components can be securely mounted, but production efficiency decreases

Engineering Contradiction:

Improvecomponent attachment reliabilityVSAvoidproduction efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent incorporates adhesive layers directly into the bonding carrier structure before component mounting. This preliminary preparation of attachment surfaces eliminates the need for separate adhering film application steps during production, streamlining the manufacturing process and increasing production efficiency while ensuring reliable component attachment.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

By combining the structural carrier and attachment adhesive into a single bonding carrier assembly, the patent reduces the number of manufacturing steps required. This integration eliminates sequential operations of mounting hard board then applying adhering film, thereby simplifying the process and improving production efficiency.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS10002825B2Method of fabricating package structure with an embedded electronic component

Publication Date: 2018.06.19 SILICONWARE PRECISION IND CO LTD

AI summary

The present invention provides a package structure with an embedded electronic component and a method of fabricating the package structure. The method includes: forming a first wiring layer on a carrier; removing the carrier and forming the first wiring layer on a bonding carrier; disposing an electronic component on the first wiring layer; forming an encapsulating layer, a second wiring layer and an insulating layer on the first wiring layer; disposing a chip on the electronic component and the second wiring layer; and forming a covering layer that covers the chip. The present invention can effectively reduce the thickness of the package structure and the electronic component without using adhesives.