Flexible Layered PCB Slip Track for High Current Power Delivery
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Solution Overview
Problem
Existing slip track systems face limitations in providing high current due to the dimensions of the metal track, making them unfeasible for scenarios with high current requirements.
Innovation Solution
A slip track architecture utilizing a flexible, layered printed circuit board with a top track layer and a lower layer connected to supply power, allowing for a continuous circuitous track that can bend around curves, enabling modular and efficient power supply to dispensing heads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a single metal track is used, then the structure is simple, but the current capacity is limited
Solution Approach 1:
The track is divided into multiple parallel conductive layers (first conductive layer, second conductive layer, third conductive layer) that are electrically connected through vertical vias. This segmentation allows current to flow through multiple pathways simultaneously, increasing total current capacity while maintaining a compact structure.
Solution Approach 2:
The patent transitions from a two-dimensional single-track design to a three-dimensional multi-layer PCB structure. Conductive layers are stacked vertically and connected through vias, creating a multi-dimensional current distribution network that significantly increases power delivery capability without proportionally increasing footprint area.
2Adaptability or versatility
If a metal track is used, then electrical resistance is low, but the track cannot be bent around curves
Solution Approach 1:
The patent uses thin flexible PCB material as the substrate for the conductive layers. This flexible film allows the track to be bent and shaped around curves while maintaining electrical integrity. The thin-film construction enables the rigid conductive traces to conform to curved paths without breaking or losing connection.
Solution Approach 2:
The track structure combines multiple materials: flexible PCB substrate, conductive copper traces, insulating solder mask, and conductive plating in vias. This composite construction provides both the flexibility needed for curving and the electrical reliability required for power transmission, resolving the contradiction between adaptability and connection reliability.
3Power
If the track cross section area is increased, then current capacity increases, but the track dimensions become larger
Solution Approach 1:
Instead of increasing current capacity by widening the track in the horizontal plane, the patent adds vertical dimensionality through multiple stacked conductive layers. Current flows through multiple parallel pathways in the Z-direction, achieving high power capacity without increasing the X-Y footprint of the track.
Solution Approach 2:
The current path is segmented into multiple parallel conductive layers that collectively carry the total current. Each layer contributes a portion of the current capacity, and the layers are connected through vias to create redundant current pathways, achieving high power delivery in a compact cross-sectional area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for a more feasible and efficient power supply to dispensing heads, accommodating high current requirements and enabling modular expansion, while maintaining flexibility and signal integrity.
Implementation Method 1
the top track layer configured to supply electric power to a device having a contact element sliding across the top track layer, the layered printed circuit board further having a lower layer connected to the top track layer, the lower layer configured to supply electric power to the top track layer
Data Source
AI summary
A slip track includes a continuous circuitous track. The continuous circuitous track includes a layered printed circuit board. The layered printed circuit board includes a top track layer configured to supply electric power to a device having a contact element sliding across the top track layer, the layered printed circuit board further having a lower layer connected to the top track layer, the lower layer configured to supply electric power to the top track layer. The layered printed circuit board is flexible and is bent around curves in the continuous circuitous track. A method of assembly using the slip track is further disclosed.