Induction Heating and Cooling Device for Semiconductor Soldering
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Solution Overview
Problem
Conventional soldering apparatuses face inefficiencies in heating and cooling processes, particularly with Sn-Sb based solder materials, leading to void generation and poor miniaturization due to reliance on natural cooling and contact-type thermal conduction, which affects the quality and efficiency of solder joints in semiconductor modules.
Innovation Solution
A heating and cooling device with an airtight processing chamber using induction heating and a transfer apparatus to precisely control temperature, allowing for efficient heating and cooling under a reducing gas atmosphere, and featuring a cooling unit integrated with the induction heating coil to enhance thermal management and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If natural cooling is used after heating, then the apparatus structure is simple, but the cooling efficiency is poor and the process time is long
Solution Approach 1:
The cooling unit is integrated with the induction heating coil structure, merging the heating and cooling functions into a single compact assembly. This allows the apparatus to achieve rapid cooling efficiency while maintaining structural simplicity, as the cooling unit shares space and structural elements with the heating coil rather than requiring separate dedicated cooling infrastructure.
Solution Approach 2:
The transfer apparatus dynamically adjusts the distance between the member-to-be-processed and the cooling unit during the cooling process. By controlling this distance, the system can optimize cooling efficiency at different stages of the process, achieving rapid cooling when needed while maintaining operational flexibility and preventing thermal damage.
2Use of energy by moving object
If contact-type thermal conduction heating is used, then the heating is direct and efficient, but residual heat in the heating plate reduces cooling efficiency
Solution Approach 1:
The cooling unit is designed as a separate, removable component that can be extracted from the heating assembly. This allows the cooling function to be independently controlled and positioned, preventing residual heat from the heating plate from interfering with the cooling process. The cooling unit can be brought into contact with the workpiece only when needed for cooling, eliminating the heat transfer problem from the heating plate.
Solution Approach 2:
The transfer apparatus enables dynamic control of the distance between the workpiece and cooling unit, allowing the system to switch between heating and cooling modes efficiently. During heating, the cooling unit is positioned away from the workpiece; during cooling, it is brought into contact. This dynamic positioning prevents residual heat interference while maintaining both heating and cooling efficiencies.
3Manufacturing precision
If separate zones for heating and cooling are provided, then each zone can be optimized independently, but the apparatus size increases and miniaturization is limited
Solution Approach 1:
The cooling unit is merged with the induction heating coil structure, combining what would traditionally be separate heating and cooling zones into a single integrated assembly. This integration maintains the functional independence of heating and cooling zones while dramatically reducing the overall apparatus volume, enabling miniaturization without sacrificing zone optimization capabilities.
Solution Approach 2:
The cooling unit is nested within or around the induction heating coil structure, placing one functional unit inside or adjacent to another. This nesting arrangement allows both heating and cooling zones to coexist in a compact configuration, optimizing each zone's performance while minimizing the total apparatus size and enabling miniaturization.
4Device complexity
If the chamber is open to the atmosphere, then the apparatus structure is simple, but surface oxide forms on the member-to-be-soldered reducing solder wettability
Solution Approach 1:
The processing chamber is configured to provide a reducing gas atmosphere during the soldering process. This inert environment prevents oxidation of the member-to-be-soldered surface, ensuring excellent solder wettability and joint quality. The chamber structure maintains this controlled atmosphere while remaining relatively simple in design, using gas flow control rather than complex vacuum or sealed systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables rapid and precise temperature control, reducing void formation and enhancing the efficiency of solder reflow processes, improving the quality of solder joints and allowing for the miniaturization of the apparatus while maintaining high throughput.
Implementation Method 1
an induction heating apparatus including one or a plurality of induction heating coils by which the member-to-be-processed is heated
Implementation Method 2
a cooling unit cooling down the member-to-be-processed
Data Source
AI summary
A heating and cooling device including: an airtight processing chamber openable to load a member-to-be-processed in the airtight processing chamber; a transfer apparatus to adjust a distance between the member-to-be-processed and a cooling unit that cools the member-to-be-processed, by moving the member-to-be-processed and/or the cooling unit; an induction heating apparatus to heat the member-to-be-processed, including a induction heating coil; a cooling apparatus to cool the member-to-be-processed by cooling the cooling unit; a temperature sensor to determine a temperature of the member-to-be-processed; and a controller to control the induction heating apparatus and the cooling apparatus based on the temperature determined by the temperature sensor.