Laser Welded Contact Sleeve for Semiconductor Module
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Solution Overview
Problem
Existing methods for connecting semiconductor modules in electronic devices face challenges in confined spaces, often risking damage to semiconductor components due to high heat input during soldering and limited mechanical stability, especially when trying to achieve reliable electrical connections.
Innovation Solution
A method involving a contact sleeve bonded to a metallic contact surface on a carrier using laser welding, which allows for a reliable electrical connection with reduced heat input and enhanced mechanical stability, enabling secure connections even in tight spaces by using an overlap weld and a web feature to shield adjacent components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a soldering process is used to bond contact elements to the carrier, then reliable electrical connection is achieved, but thermal damage to semiconductor components occurs due to high heat input
Solution Approach 1:
The patent replaces the thermal soldering process with a laser welding process that uses optical energy to create a metallurgical bond between the contact sleeve and carrier. The laser beam melts the contact surface and contact sleeve material to form a weld pool, creating a strong mechanical and electrical connection without the prolonged thermal exposure of soldering.
Solution Approach 2:
The patent changes the bonding parameters from soldering temperature and time to laser welding parameters including laser power, pulse duration, and focal position. By using pulsed laser welding with controlled energy input, the process achieves reliable bonding while limiting heat diffusion to adjacent semiconductor components.
2Volume of moving object
If contact elements are bonded directly to the carrier in confined spaces, then space requirements are reduced, but mechanical stability and connection reliability deteriorate
Solution Approach 1:
The patent introduces a contact sleeve as an intermediary component between the contact pin and carrier. The contact sleeve is laser-welded to the carrier and receives the contact pin, providing mechanical support and electrical connection. This intermediary structure enables reliable connections in confined spaces by distributing mechanical stresses and providing a stable bonding interface.
3Strength
If multiple welding points are used to bond the contact sleeve, then connection strength is improved, but heat input and risk of thermal damage increase
Solution Approach 1:
The patent uses pulsed laser welding where the laser beam is applied in periodic pulses rather than continuous exposure. Each pulse creates a localized weld point, and by controlling pulse duration and frequency, multiple welding points can be created with minimal heat accumulation and reduced thermal damage to surrounding semiconductor components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces thermal damage to semiconductor components and provides high mechanical stability, allowing for compact module designs with secure and reliable electrical connections, minimizing the risk of component damage during the connection process.
Implementation Method 1
bonded to the contact surface using a laser welding method
Implementation Method 2
the laser radiation reflected at the welding zone
Data Source
Figure 1~3
Figure 4~6
AI summary
In a method for the production of a pluggable connection contact on a semiconductor module, having at least one semiconductor element (4) disposed on a carrier (2), a contact sleeve (8) is placed on a metallic contact surface (6) located on the carrier (2), and is bonded to the contact surface (6) by means of a laser welding method.