Wiring Board Peeling Layer Thermal Expansion Match
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Solution Overview
Problem
The existing methods for manufacturing wiring boards with semiconductor chip mounting surfaces face challenges in maintaining the desirable pitch of electrode pads due to thermal expansion differences between wiring layers and insulating layers, leading to warpage and distortion, which complicates the connection with semiconductor chips, especially when pitches are small.
Innovation Solution
A method involving the formation of a peeling layer on a support board with a thermal expansion coefficient matching that of the semiconductor substrate, allowing for the precise formation and removal of wiring and insulating layers without significant pitch shift, using materials like silicon or borosilicate glass to minimize thermal stress-induced distortions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the support board is removed after wiring layer formation, then the wiring board thickness is reduced and electrical characteristics are enhanced, but the support board cannot be reused increasing manufacturing costs
Solution Approach 1:
The patent introduces a peeling layer as an intermediary between the silicon support board and the wiring structure, enabling easy separation after use and allowing the support board to be reused for multiple manufacturing cycles
Solution Approach 2:
The patent enables recovery and reuse of the expensive silicon support board by using a removable peeling layer, discarding only the inexpensive peeling layer while retaining the valuable support board for subsequent manufacturing processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the shift in pitch of electrode pads on the wiring board, ensuring accurate electrical connections with semiconductor chips even at smaller pitches, while also allowing for repetitive use of the support board and reducing manufacturing costs.
Implementation Method 1
a peeling layer 15 formed on the support board 11... a treatment is carried out over the peeling layer 15 to remove the support board 11
Implementation Method 2
support board formed by a material having a coefficient of thermal expansion which is equal to that of a semiconductor substrate... reduce a shift, from a desirable pitch, of a pitch of an electrode pad
Data Source
AI summary
A method of manufacturing a wiring board having a semiconductor chip mounting surface for mounting a semiconductor chip thereon which is manufactured by a process including a step of forming a wiring layer and an insulating layer on a support board and a step of removing the support board, including a peeling layer forming step of forming a peeling layer on the support board formed by a material having a coefficient of thermal expansion which is equal to that of a semiconductor substrate constituting the semiconductor chip, and a support board removing step of removing the support board by carrying out a predetermined treatment over the peeling layer.