Embedded Component PCB Bonding via Adhesive Recess Filling
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Solution Overview
Problem
Existing methods for embedding components in printed circuit boards often result in delamination issues due to cavities between the chip and adjacent layers, leading to detachment risks during additional layer buildup.
Innovation Solution
A method involving a printed circuit board with an insulating layer, a patterned conductive layer, and a recessed component embedded in an adhesive layer, where the spaces between contacts are filled with a resist, and an additional conductive layer is applied to form connections in the same plane as the contacts, using a semi-additive process to deposit conductor material and remove excess layers through flash-etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a component is embedded in a printed circuit board with a gap between the chip and adjacent layers, then the component can be easily inserted and bonded, but cavities remain in the spacing area which may lead to delamination issues during the buildup of additional layers
Solution Approach 1:
The adhesive layer is applied in advance to completely fill the recess before the component is embedded. This preliminary action ensures that no cavities remain between the component and adjacent layers, preventing delamination issues during subsequent layer buildup while maintaining ease of component embedding
Solution Approach 2:
The adhesive layer is specifically applied to the recess area surrounding the component contacts, providing localized filling only where needed. This ensures complete enclosure of the spacing area without affecting other parts of the circuit board, resolving the delamination risk locally while preserving manufacturing ease
2Reliability
If the contacts of the component are bonded with a conductor pattern using conventional methods, then electrical connections can be established, but the process becomes complex and costly with additional layers required
Solution Approach 1:
The adhesive layer serving as both the mechanical bonding medium and the electrical connection medium is applied. The conductor pattern is integrated directly into the adhesive layer, merging the bonding function and electrical connection function into a single layer, thereby reducing device complexity while maintaining reliable electrical connections
Solution Approach 2:
The adhesive layer is designed to perform multiple functions simultaneously: it provides mechanical bonding of the component, fills the recess to prevent delamination, and carries the conductor pattern for electrical connections. This multi-functionality reduces the need for additional separate layers and processes
3Adaptability or versatility
If additional layers are built up over the embedded component, then the circuit board functionality is enhanced, but the cavity between the chip and adjacent layers increases the risk of detachment
Solution Approach 1:
The adhesive layer is applied in advance to completely fill the recess before any additional layers are built up. This preliminary filling action eliminates cavities that would otherwise create detachment risks during subsequent layer buildup, ensuring layer structure stability while allowing enhanced circuit board functionality
Solution Approach 2:
The adhesive layer acts as a cushioning material that pre-fills the recess area, providing mechanical support and preventing future detachment. This beforehand cushioning ensures that when additional layers are built up, there is no empty space to cause delamination, maintaining layer structure stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for reliable and cost-effective bonding of components in the same plane, preventing delamination and enabling thinner printed circuit boards without detachment risks.
Implementation Method 1
at least one component (6) embedded in an adhesive layer (7) disposed within the recess (5)
Implementation Method 2
depositing a layer of conductive material onto the end faces of the contacts and the conductive layer
Implementation Method 3
forming a conductor pattern on at least one outer surface of the core, and a plurality of interconnecting paths between the plurality of contacts and the conductor pattern
Data Source
AI summary
The disclosure pertains to a method for the bonding of a component embedded into a printed circuit board. The methods include provisions of a core exhibiting at least one insulating layer and at least one conductor layer applied to the insulating layer. Methods may also include embedding at least one component into a recess of the insulating layer, wherein the contacts of the component are essentially situated in the plane of an outer surface of the core exhibiting the at least one conductor layer. Methods may also include application of a photoimageable resist onto the one outer surface of the core on which the component is arranged, while filling the spaces between the contacts of the component. Methods may also include clearing of end faces of the contacts and of the areas of the conductor layer covered by the photoimageable resist by exposing and developing the photoimageable resist.