Electroplated Platinum Rivet Bonding for Implantable Electronics
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Solution Overview
Problem
Existing methods for bonding a flexible circuit to an electronics package for implantation in living tissue face biocompatibility and mechanical stability issues, as conventional materials like tin-lead solder and gold are either toxic or unreliable in saline environments, and known deposition techniques fail to achieve a strong, long-lasting bond.
Innovation Solution
An electroplated platinum or gold rivet-shaped connection is used to bond a hermetic electronics control unit to a flexible circuit, ensuring biocompatibility and long-term mechanical attachment stability, suitable for implantation in living tissue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding materials like tin-lead solder or gold are used to bond flexible circuit to electronics package, then electrical connection is achieved, but biocompatibility and reliability deteriorate due to toxicity or corrosion in saline environment
Solution Approach 1:
The patent changes the material parameter from conventional soldering materials (tin-lead, gold) to platinum, which has superior biocompatibility and electrochemical stability. This material substitution resolves the contradiction by maintaining bond reliability while eliminating toxicity and corrosion issues in the saline environment of the eye.
Solution Approach 2:
The patent employs a composite bonding structure consisting of platinum rivets embedded in a biocompatible adhesive matrix. This composite approach combines the mechanical strength and electrical conductivity of platinum with the bonding capability and biocompatibility of the adhesive, achieving both reliable electrical connection and long-term biocompatibility.
2Strength
If conventional deposition techniques are used to form bonds, then manufacturing simplicity is maintained, but bond strength and mechanical stability deteriorate
Solution Approach 1:
The patent incorporates platinum rivets into the flexible circuit or electronics package prior to final assembly. This preliminary placement of bonding elements simplifies the final bonding process while ensuring strong mechanical interconnection, as the rivets are already positioned and sized optimally for the bonding operation.
Solution Approach 2:
The patent replaces conventional chemical soldering processes with a mechanical riveting system. The platinum rivets provide direct mechanical interconnection between the flexible circuit and electronics package, eliminating the need for complex soldering procedures while achieving superior bond strength and mechanical stability.
3Ease of operation
If the device is made sufficiently flexible to conform to retina curvature, then ease of implantation is improved, but structural stability and bond durability worsen
Solution Approach 1:
The patent applies different mechanical properties to different parts of the device: the flexible circuit substrate maintains high flexibility to conform to the retina, while the bonding regions with platinum rivets provide localized structural stability. This local differentiation allows the device to be both flexible for implantation and stable for long-term operation.
Solution Approach 2:
The patent uses composite construction where a flexible substrate (such as polyimide) is combined with rigid platinum bonding elements. The flexible substrate allows the device to conform to the curved retina surface, while the platinum rivets provide localized structural stability and resistance to mechanical fatigue at the bonding interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a biocompatible and long-lived electrical connection that maintains reliability and stability over time, suitable for neural interfaces like retinal electrode arrays, by forming a strong and durable bond between the flexible circuit and the electronics package.
Implementation Method 1
An electroplated platinum or gold rivet-shaped connection is used to bond a hermetic electronics control unit to a flexible circuit
Data Source
AI summary
The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.