Embedded Die Package With Integral Passives and High-Voltage Isolation
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Solution Overview
Problem
Existing microelectronic device packages face challenges in efficiently integrating semiconductor dies with passive components like capacitors, inductors, and coils, leading to high costs and substantial package volume, while using expensive printed circuit board substrates and external mounts are costly and require significant space.
Innovation Solution
A method involving embedding semiconductor dies in dielectric material with trace and connection level conductors, forming integrated system devices, and coupling them to a package substrate using solder balls, followed by encapsulation with mold compound to create a microelectronic device package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If passive components are mounted on the exterior of packaged semiconductor devices using brackets or mounts, then ease of manufacture is improved, but device complexity and package volume increase substantially
Solution Approach 1:
The patent combines semiconductor dies and passive components into a single integrated package substrate. Multiple semiconductor dies are mounted on the substrate along with passive components, and the entire assembly is covered with mold compound to form a unified packaged device. This eliminates the need for separate exterior mounting of passive components using brackets or mounts, thereby reducing package volume while maintaining ease of manufacture.
2Manufacturing precision
If expensive printed circuit board package substrates are used, then manufacturing precision and electrical connectivity are improved, but cost increases substantially
Solution Approach 1:
The patent creates a multi-functional package substrate that serves multiple purposes: it provides mechanical support for mounting semiconductor dies, establishes electrical connections through conductive traces, and integrates passive components. This universal substrate replaces the need for expensive printed circuit board substrates while maintaining manufacturing precision and electrical connectivity requirements.
3Device complexity
If semiconductor dies and passive components are integrated within the package, then device complexity is reduced and cost is lowered, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs preliminary actions in the manufacturing process by first mounting semiconductor dies on the package substrate and establishing their precise positions before integrating passive components. The substrate is prepared with pre-defined conductive traces and mounting structures. This sequential approach with preliminary positioning reduces the overall manufacturing precision requirements compared to simultaneous integration, while still achieving the goal of reduced device complexity and cost.
Data Source
AI summary
An example microelectronic device package includes an integrated system device, further including: at least two semiconductor dies embedded in dielectric material and spaced from one another; layers of trace level conductors formed over the at least two semiconductor dies, and layers of connection level conductors extending through layers of dielectric material between the layers of trace level conductors, the integrated system device having conductive lands on a board side surface exposed from dielectric material. A package substrate has a first set of conductive leads on one side spaced from a second set of conductive leads on an opposite side. The conductive lands are mounted to internal ends of the first set of conductive leads and to internal ends of the second set of conductive leads. Mold compound covers the integrated system device, portions of the first set of leads, and portions of the second set of leads.