Embedded Electrode Tray for Stable Wafer Clamping
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Solution Overview
Problem
Existing wafer holding apparatuses with trays between electrostatic chucks and clamp objects do not provide sufficient clamping force to securely hold the tray and clamp objects, leading to instability and potential contamination risks.
Innovation Solution
A tray design with an upper and lower electrode embedded in the support base, connected by interconnect lines, is placed on an electrostatic chuck, allowing for optimized electrostatic clamping forces between the electrodes and the clamp object, enhancing the secure attachment and cooling capabilities of the tray and clamp object.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If a single electrode is used in the tray, then the device complexity is reduced, but the clamping force is insufficient to securely hold the tray and clamp objects
Solution Approach 1:
The electrode is divided into multiple segments (first electrode, second electrode, third electrode) positioned at different locations within the tray. Each electrode segment independently contributes to the clamping force, allowing the system to achieve sufficient total clamping force while maintaining a relatively simple overall structure. The segmentation enables distributed electrostatic actuation across the tray surface.
Solution Approach 2:
Multiple electrode segments are combined within a single tray structure, with all electrodes electrically connected to the same voltage source. This merging of multiple electrostatic actuation points creates a cumulative clamping force that securely holds both the tray on the electrostatic chuck and the wafer on the tray, while the electrodes share a common electrical connection structure.
2Force
If electrodes are positioned closer to the surface, then the clamping force on the wafer is improved, but the structural strength of the tray is reduced
Solution Approach 1:
The tray structure exhibits local quality variations: the regions around the electrode embedding points have modified structural properties to accommodate the electrodes, while other regions maintain optimal mechanical strength. The electrodes are embedded at specific depths and positions that optimize the local electric field distribution for wafer clamping without compromising the overall structural integrity of the tray.
Solution Approach 2:
The electrodes are nested within cavities or embedding regions in the tray structure, with the electrode material contained within the tray body. This nesting arrangement allows the electrodes to be positioned effectively for electrostatic actuation while the surrounding tray material provides structural support and strength, creating a hierarchical structure where the tray contains the electrodes which in turn generate the clamping force.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The tray achieves a sufficient electrostatic clamping force, ensuring stable attachment and simultaneous cooling of both the tray and clamp object, improving the yield of semiconductor manufacturing processes and preventing contamination by keeping metal films internal.
Implementation Method 1
the tray is securely held on the electrostatic chuck by a clamping force between the electrostatic chuck and the electrode of the tray
Data Source
AI summary
A tray includes a support base having both a first face on which a clamp object is placed and a second face opposite the first face, an upper electrode embedded in the support base and situated toward the first face, a lower electrode embedded in the support base and situated further toward the second face than the upper electrode is, and one or more interconnect lines configured to provide an electrical connection between the upper electrode and the lower electrode.