Embedded Flexible Circuit Layer in PCB Interlayer Structure
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Solution Overview
Problem
The connection between printed circuit boards (PCBs) and flexible circuit boards in existing designs requires complex binding processes or electrical connectors, which complicates product thinning, stability, and yield due to limited connector height and stringent gold finger binding requirements.
Innovation Solution
Integrating a flexible circuit board into the manufacturing process of a printed circuit board by embedding part of its circuit layers within the interlayer structure and pressing them together, eliminating the need for later-stage binding or connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrical connectors or gold finger binding are used to connect the printed circuit board and flexible circuit board, then the connection is realized, but the product height is increased and the binding process becomes complicated
Solution Approach 1:
The patent merges the rigid circuit board and flexible circuit board into a single integrated structure. The flexible circuit board is embedded within the rigid circuit board's interlayer structure, eliminating the need for separate connectors or binding processes. This integration resolves the contradiction by achieving both reliable connection and process simplification simultaneously.
Solution Approach 2:
The flexible circuit board is nested within the rigid circuit board's multi-layer structure. Specifically, the flexible circuit board is positioned between the first and second copper foil layers, with its edges extending to the edge of the rigid circuit board. This nesting approach enables direct electrical connection without external connectors, reducing both complexity and height.
2Reliability
If gold finger binding process is used, then the circuit boards are connected, but the pad spacing requirements are stringent and the binding process is complicated
Solution Approach 1:
The patent combines the flexible and rigid circuit boards into a single manufactured unit during the PCB fabrication process. The flexible circuit board is embedded within the rigid board's interlayer structure, and electrical connections are established through integrated copper foil layers and vias rather than through separate gold finger binding. This eliminates the stringent pad spacing requirements associated with traditional binding methods.
3Reliability
If electrical connectors are used, then the circuit boards are connected, but the product space is occupied and the product cannot be made thinner
Solution Approach 1:
The flexible circuit board is nested within the rigid circuit board's internal structure, specifically between the first and second copper foil layers. This internal positioning eliminates the need for external connectors that would increase product height. The integrated design allows the connection to be made within the existing thickness of the rigid circuit board, enabling product thinning while maintaining reliable electrical connection.
4Adaptability or versatility
If the flexible circuit board and printed circuit board are prepared independently and connected later, then the manufacturing process is flexible, but the binding process requirements are higher and the process is more complicated
Solution Approach 1:
The patent performs the integration of the flexible and rigid circuit boards during the initial PCB manufacturing process rather than as a separate later-step operation. The flexible circuit board is embedded within the rigid board's interlayer structure while the PCB is being fabricated, utilizing the same lamination and drilling processes. This preliminary integration eliminates the need for complex post-manufacturing binding operations while maintaining manufacturing flexibility.
Data Source
AI summary
A circuit board and a display module are disclosed. The display module includes a display panel and the circuit board. The circuit board includes a hard first board body and a soft second board body. By integrating a flexible circuit layer into a preparation process of the first board body, a combination of the first board body and the second board body is realized. This avoids a late binding process or an access of electrical connectors, so that a product becomes lighter and thinner and a connection stability is enhanced.