Embedded Heat Pipe Base Plate for IC Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heat dissipation devices for integrated circuit devices face thermal bottlenecks due to the low thermal conductivity of solder materials used to attach heat pipes to base plates, which hinders efficient heat transfer and increases device thickness, making it difficult to manage the rising junction temperatures of smaller, more densely packed IC devices.
Innovation Solution
An additively manufactured heat dissipation device with at least one heat pipe partially embedded in a base plate formed through processes like cold spraying, which eliminates the need for solder and reduces thickness while maintaining or improving thermal conductivity, allowing for direct heat transfer and enhanced structural rigidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If solder material is used to attach heat pipes to base plate, then structural connection is achieved, but thermal conductivity decreases creating thermal bottleneck
Solution Approach 1:
The invention removes the solder material layer from between the heat pipe and base plate, eliminating the thermal bottleneck created by the low thermal conductivity solder material while maintaining structural connection through direct contact or alternative bonding methods
Solution Approach 2:
The invention uses a composite structure where the base plate and heat pipe are made of high thermal conductivity materials directly bonded together, eliminating the need for solder material and creating a continuous thermal path from the heat generating component through the heat pipe to the heat sink
2Reliability
If conventional heat dissipation device structure is used, then heat transfer is enabled, but device thickness increases
Solution Approach 1:
The invention merges the base plate and heat pipe into a more integrated structure where the heat pipe is partially embedded in the base plate, reducing the overall thickness by eliminating the solder layer and optimizing the thermal path length while maintaining effective heat transfer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces thermal resistance, enables thinner device designs, and accommodates thicker/larger heat pipes for improved thermal dissipation, effectively managing heat in densely packed IC devices without the limitations of traditional solder materials.
Implementation Method 1
the working fluid transfers heat by vaporizing near the integrated circuit device 120, condensing near the external heat sink 150
Implementation Method 2
the at least one heat pipe 140 may convey heat away from the integrated circuit device 120 to an external heat sink 150
Implementation Method 3
an additively manufactured base plate having at least one heat pipe at least partially embedded therein
Data Source
AI summary
A heat dissipation device for an integrated circuit assembly may be fabricated to include at least one heat pipe that is at least partially embedded in a base plate that is formed with an additive manufacturing process, such as cold spraying. Embedding the at least one heat pipe in the base plate, rather than soldering the heat pipe to the base plate, eliminates the thermal bottleneck presented by the soldering material and reduces the overall height or thickness of the integrated circuit assembly.