Embedded IC Packaging with Wire-in-Film Adhesive
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Solution Overview
Problem
Current integrated circuit packaging technologies face challenges in achieving smaller footprints, reduced production costs, and improved reliability while managing increasing complexity and environmental factors such as EMI radiation, thermal loads, and high-frequency data transmission.
Innovation Solution
The integration circuit packaging system positions the integrated circuit below the substrate's top surface, utilizing a wire-in-film adhesive for protection and thermal management, and incorporates multiple chips with optimized interconnects to reduce package size and interconnection length, thereby minimizing material usage and parasitic inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the integrated circuit is positioned on the substrate surface with traditional packaging, then the assembly is straightforward, but the package footprint is larger and interconnection length is increased
Solution Approach 1:
The integrated circuit die is positioned within a recess or cavity formed in the substrate, effectively nesting the die within the substrate structure. This nesting approach reduces the overall package footprint by utilizing the substrate's vertical space rather than extending the die laterally on the substrate surface, while the substrate itself serves as the packaging structure that protects and supports the die.
Solution Approach 2:
The invention transitions from a traditional planar arrangement where the die sits on the substrate surface to a three-dimensional configuration where the die is embedded within the substrate's depth. This dimensional change allows for shorter interconnection lengths and reduced package footprint while maintaining electrical connectivity through vertical vias or conductive structures within the substrate.
2Reliability
If traditional wire bonding is used with longer wire sweeps, then the assembly process is simpler, but parasitic inductance increases and reliability decreases
Solution Approach 1:
The invention extracts or removes the traditional wire bonding process from the assembly methodology. By positioning the die within the substrate and utilizing direct conductive connections through the substrate material itself, the need for separate wire bonding steps is eliminated, thereby reducing parasitic inductance associated with long wire sweeps while maintaining assembly reliability.
Solution Approach 2:
The substrate serves as an intermediary structure that provides direct electrical pathways between the die and external connections. Instead of using long wire sweeps as intermediaries, the substrate's internal conductive structures (such as embedded traces or vias) act as the intermediary, providing shorter, lower-inductance connection paths that improve reliability.
3Object-affected harmful factors
If more material is used for protection and packaging, then environmental protection is improved, but manufacturing cost increases
Solution Approach 1:
The substrate is designed to perform multiple functions simultaneously: it serves as the mechanical support structure, the electrical interconnection medium, and the protective packaging enclosure. This multi-functionality eliminates the need for separate protective housing materials, reducing overall material usage and manufacturing cost while maintaining environmental protection through the substrate's inherent protective properties.
Solution Approach 2:
The invention merges the protective packaging function with the substrate structure itself. Instead of adding separate protective materials around the die, the substrate is designed to encapsulate and protect the die within its recessed structure, combining the protection function with the existing substrate material and reducing the need for additional protective materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in reduced package size, lower manufacturing costs, enhanced thermal cooling, and improved reliability by minimizing wire sweeps and parasitic inductance, while maintaining effective protection against environmental factors.
Implementation Method 1
utilizing a wire-in-film adhesive for protection and thermal management
Implementation Method 2
minimizing material usage and parasitic inductance
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a substrate having a through hole; mounting an integrated circuit in the through hole, the integrated circuit having an inactive side and a vertical side; connecting a first interconnect in direct contact with the integrated circuit and the substrate; applying a wire-in-film adhesive around and above the integrated circuit leaving a portion of the vertical side and the inactive side exposed and covering a portion of the first interconnect; and mounting a chip above the integrated circuit and in direct contact with the wire-in-film adhesive.