Embedded Image Sensor Package with Cavity and Protection Layer
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Solution Overview
Problem
The manufacturing costs of image sensor packages at a wafer level are high due to limitations in reducing costs, and there is a need for more efficient methods to integrate image sensors with signal processing circuits while maintaining low power consumption and scalability.
Innovation Solution
The development of embedded image sensor packages with a core layer having a cavity, an image sensor chip with a light receiver and connection members, a first insulation layer with openings for light reception, a protection layer to prevent contamination, and a light transmission layer for efficient light reception and signal processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If image sensor packages are provided at wafer level, then manufacturing throughput is limited, but manufacturing costs cannot be reduced further
Solution Approach 1:
The image sensor chip is segmented from the wafer level to a smaller chip level, allowing multiple chips to be mounted on a single substrate. This segmentation enables parallel processing and assembly, thereby increasing manufacturing throughput while reducing per-unit costs through economies of scale in substrate production
Solution Approach 2:
The image sensor chip is nested within a cavity formed in the substrate, creating an embedded package structure. This nesting approach allows for efficient space utilization and integration with other components on the substrate, enabling higher density packaging and improved manufacturing efficiency
2Illumination intensity
If the light receiving area is exposed directly, then light reception efficiency is high, but the light receiver is vulnerable to contamination
Solution Approach 1:
A protection layer is introduced as an intermediary between the light receiver and the external environment. This layer selectively allows light to pass through while blocking contaminants, thereby maintaining both light reception efficiency and protecting the light receiver from contamination
Solution Approach 2:
The protection layer is applied selectively around the light receiver with different properties in different regions: it is transparent to light in the light receiving area while providing barrier protection in surrounding areas. This local differentiation maintains optical performance while providing targeted contamination protection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs by increasing throughput and enabling the integration of image sensors with signal processing circuits while maintaining low power consumption and scalability, enhancing the efficiency of image sensor packages.
Implementation Method 1
a light transmission layer disposed on the light receiver
Implementation Method 2
an image sensor chip disposed in the cavity and having a top surface on which a light receiver and connection members are disposed
Data Source
AI summary
An embedded image sensor package includes a core layer having a cavity therein, an image sensor chip disposed in the cavity and having a top surface on which a light receiver and connection members are disposed, a first insulation layer disposed on a top surface of the core layer and the top surface of the image sensor chip and having an opening that defines a light receiving area including the light receiver, a protection layer disposed between the light receiver and the first insulation layer to surround the light receiver, and a light transmission layer disposed on the light receiver. The protection layer is disposed along edges of the light receiving area. Related methods are also provided.