Embedded Inductor Redistribution Substrate for Lower AC Loss
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packages face challenges in improving electrical properties and reliability, particularly in reducing AC loss and enhancing inductance in inductor structures.
Innovation Solution
A redistribution substrate with an inductor structure that includes an inner and outer coil pattern, where the outer coil pattern has multiple conductive layers with varying thicknesses to minimize AC loss and increase inductance, and is integrated with a semiconductor chip for improved electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a conventional single-layer conductive structure is used in the inductor, then the manufacturing process is simple, but the AC loss is high and inductance is insufficient
Solution Approach 1:
The conductive layer is segmented into multiple layers (first conductive layer and second conductive layer) with different thicknesses. The first conductive layer has greater thickness to reduce AC loss, while the second conductive layer has lesser thickness to maintain appropriate inductance. This segmentation allows optimization of electrical properties by distributing different functional requirements across multiple layers.
Solution Approach 2:
Different regions of the conductive structure are assigned different thicknesses to optimize local electrical characteristics. The first conductive layer uses greater thickness where current density is high to minimize resistive losses, while the second conductive layer uses lesser thickness to control magnetic field distribution and maintain inductance. This local quality variation resolves the contradiction between reducing AC loss and maintaining proper inductance.
2Loss of energy
If the conductive layer thickness is increased to reduce AC loss, then AC loss decreases, but inductance control becomes difficult
Solution Approach 1:
The conductive structure is divided into multiple layers with different thicknesses to independently optimize AC loss reduction and inductance control. The first conductive layer with greater thickness addresses AC loss, while the second conductive layer with lesser thickness fine-tunes inductance. This segmentation enables simultaneous achievement of both objectives without compromising manufacturing precision.
Solution Approach 2:
The inductor employs a composite conductive structure combining multiple layers of conductive material with different thicknesses. This composite approach allows the structure to exhibit both low AC loss characteristics (from the thicker first layer) and precise inductance control (from the thinner second layer), resolving the contradiction between energy loss reduction and inductance precision.
3Reliability
If a multi-layer conductive structure with varying thicknesses is used, then AC loss is reduced and inductance is enhanced, but the manufacturing complexity increases
Solution Approach 1:
The conductive structure is segmented into two distinct layers with different thicknesses to achieve superior electrical performance. The first conductive layer with greater thickness reduces AC loss, while the second conductive layer with lesser thickness enhances inductance control. This segmentation strategy improves reliability by optimizing electrical characteristics while keeping the manufacturing process manageable through a systematic multi-layer approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces AC loss and enhances inductance, leading to increased power efficiency and reliability of semiconductor packages.
Implementation Method 1
an inductor structure in the redistribution substrate that is electrically connected to the semiconductor chip. The inductor structure may include: an outer coil pattern that includes a plurality of vertical parts and a horizontal part connecting the plurality of vertical parts to each other; and an inner coil pattern between the vertical parts and electrically connected to the outer coil pattern
Data Source
AI summary
Disclosed are redistribution substrates and semiconductor packages including the same. The semiconductor package comprises a redistribution substrate, a semiconductor chip mounted on the redistribution substrate, and an inductor structure in the redistribution substrate and electrically connected to the semiconductor chip. The inductor structure includes an outer coil pattern including a plurality of vertical parts and a horizontal part that connects the plurality of vertical parts to each other, and an inner coil pattern between the vertical parts and electrically connected to the outer coil pattern. The horizontal part includes a first conductive layer, and a second conductive layer between the first conductive layer and the inner coil pattern. The second conductive layer has a thickness that is less than a thickness of the first conductive layer.