Embedded Inductor Core Manufacturing via Diced Magnetic Plate
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Solution Overview
Problem
The integration of passive components with high capacitance and inductance values in embedded chip assemblies is challenging due to the difficulty in manufacturing small, low-loss inductors, as existing discrete inductors are large and hard to manufacture.
Innovation Solution
A method for producing an inductor core by forming electrical conductors on a plate-shaped magnetic core, which is then diced to create multiple inductor cores, allowing for easy assembly and connection to form a coil with high inductance values, using ferromagnetic materials and conductor tracks to minimize losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If discrete inductors are assembled and electrically connected to a PCB, then inductance values can be achieved, but the inductors are large and occupy significant space
Solution Approach 1:
The inductor is segmented into multiple layers with conductive traces on different levels of the PCB. The first conductor is on a first surface, the second conductor is on a second surface, and they are electrically connected through intermediate conductors (via holes) passing through the PCB substrate, dividing the inductor structure into manageable segments that fit within the board thickness
Solution Approach 2:
The inductor structure transitions from a planar 2D layout to a 3D multi-layer configuration. By utilizing the vertical dimension (thickness) of the PCB with conductors on opposite surfaces and intermediate connections through the substrate, the design achieves higher inductance values in a compact footprint by exploiting spatial dimensions beyond the board surface
2Volume of moving object
If embedded inductors are used to reduce size, then space is saved, but they are difficult to manufacture with low losses
Solution Approach 1:
The inductor structure is merged with the PCB itself, using the PCB substrate as the magnetic core and integrating conductive traces directly into the board layers. This eliminates the need for separate discrete inductor components and their associated mounting processes, simplifying manufacturing while maintaining low losses through direct trace connections
Solution Approach 2:
The PCB substrate serves multiple functions: it acts as the structural support, the magnetic core material, the insulation layer between conductors, and the pathway for intermediate conductors. This multi-functionality reduces the number of separate components and assembly steps, making the embedded inductor easier to manufacture while achieving compact size
3Adaptability or versatility
If inductors are embedded in chip assemblies for RF applications, then integration is improved, but ohmic and magnetic losses increase
Solution Approach 1:
The inductor utilizes composite construction with conductive traces (copper or other low-resistance materials) on non-conductive PCB substrate layers (fiberglass, polyimide). This composite structure provides both the necessary electrical conductivity for low ohmic losses and the magnetic properties of the substrate material, while the multi-layer configuration optimizes the magnetic flux path to reduce magnetic losses
Data Source
AI summary
A method for manufacturing an inductor core is developed, wherein the method comprises the following: Forming a first electrical conductor on a first surface of a plate-shaped magnetic core; forming a second electrical conductor on a second surface of the plate-shaped magnetic core, which is opposite the first surface; and forming the inductor core by dicing the plate-shaped magnetic core transverse to the first electrical conductor and second electrical conductor.