Embedded Inductor Interconnect With Asymmetric Magnetic Core Stacking
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving higher integration density of electronic components due to limitations in reducing minimum feature size, leading to a need for more space-efficient and creative packaging techniques for semiconductor die structures.
Innovation Solution
The integration of an embedded inductor within the interconnect structure of semiconductor devices, utilizing a conductor coil and asymmetric magnetic cores formed by sub-layers of different materials, to enhance integration density and facilitate anisotropic induction effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If minimum feature size is reduced to increase integration density, then more components can be integrated into a given area, but manufacturing precision and reliability deteriorate due to physical limitations
Solution Approach 1:
The patent transitions from planar 2D component layout to three-dimensional 3D stacking architecture, where electronic components are arranged in multiple vertical layers. This dimensional change allows integration density to increase by utilizing the third dimension (vertical space) rather than being constrained to horizontal plane reduction, thereby avoiding the manufacturing precision limits associated with further miniaturization of minimum feature size.
Solution Approach 2:
The patent implements nested packaging where smaller electronic components are embedded within or between larger structural elements. The interconnect structure serves as a container that houses both the conductor coil and magnetic core in a nested arrangement, with the magnetic core positioned within the interconnect structure. This nesting approach maximizes space utilization and increases integration density without requiring proportional reduction of individual component dimensions.
2Quantity of substance
If more components are integrated into a given area, then device functionality increases, but device complexity increases making manufacturing and assembly more difficult
Solution Approach 1:
The patent merges multiple functional components into a unified interconnect structure. The conductor coil, magnetic core, and interconnect structure are integrated into a single packaged unit rather than being separate discrete components. This merging reduces the number of individual packaging operations required and simplifies the overall device architecture, thereby increasing component integration while managing device complexity.
Solution Approach 2:
The interconnect structure serves multiple functions simultaneously: it provides electrical interconnection, houses the conductor coil, contains the magnetic core, and acts as a structural support element. This multi-functionality reduces the need for separate dedicated structures for each function, thereby increasing component integration density while avoiding proportional increases in device complexity.
3Quantity of substance
If conventional packaging techniques are used, then manufacturing processes are simple, but space efficiency and integration density are limited
Solution Approach 1:
The patent forms the conductor coil and magnetic core within the interconnect structure during the semiconductor manufacturing process itself, before final device assembly. The magnetic core is formed by depositing magnetic material within the interconnect structure, and the conductor coil is integrated in a similar manner. These preliminary actions eliminate the need for separate post-manufacturing packaging steps, thereby achieving advanced 3D integration density while maintaining ease of manufacture through standard semiconductor fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for increased integration density of electronic components by embedding the inductor within the interconnect structure, enabling efficient electrical transmission and enhancing the semiconductor device's performance.
Implementation Method 1
a conductor coil disposed on the substrate, and wounded around the magnetic core
Implementation Method 2
utilizing a conductor coil and asymmetric magnetic cores formed by sub-layers of different materials, to enhance integration density and facilitate anisotropic induction effects
Data Source
AI summary
A semiconductor device including a substrate, a magnetic core and a conductor coil is provided. The magnetic core is disposed on the substrate, and formed by sub-layers of different materials stacked alternatively on one another. The conductor coil is disposed on the substrate, wherein the magnetic core partially extends to a level between an upper surface of the conductor coil and a bottom surface of the conductor coil.