Embedded Inductor Structure for Scalable Power Delivery
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current organic substrates with symmetric metal and dielectric layer formation limit inductance due to the inherent limitations of copper conductors, which increase resistance when made thinner for higher inductance, and discrete component inductors fail to deliver power to other power planes effectively.
Innovation Solution
The formation of embedded inductors with partial turns of coils on successive dielectric layers coupled by conductive vertical interconnects, optionally with a magnetic core, allows for scalable inductance without sacrificing copper thickness, using an ultra-thin core and magnetic materials to enhance inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If copper lines are made thinner to achieve greater inductance, then inductance increases, but resistance increases and power delivery performance decreases
Solution Approach 1:
The patent transitions from planar inductor designs to three-dimensional vertical inductor structures. Multiple partial turns are formed on different dielectric layers and connected via through-dielectric vias to create full turns, utilizing the vertical dimension to achieve higher inductance without reducing copper line thickness. This dimensional transition allows maintaining low resistance while increasing inductance through spatial configuration rather than line thinning.
Solution Approach 2:
The patent employs composite structures combining copper conductors with magnetic core materials (ferrite, nickel-zinc ferrite, or nickel-copper-nickel permalloy). The magnetic core material is positioned within the coil structure to enhance the magnetic field and increase inductance without requiring thinner copper lines. This composite approach allows achieving higher inductance while maintaining optimal copper thickness for low resistance.
2Area of stationary object
If discrete component inductors are used to reduce dependence on thinner copper conductors, then inductance can be increased, but the ability to deliver power to other power planes is compromised
Solution Approach 1:
The patent merges the inductor function with the substrate's power delivery network by integrating the vertical inductor structure directly into the substrate layers. The through-dielectric vias that connect partial turns also serve as power delivery pathways to other power planes, eliminating the need for separate discrete inductor components. This integration allows the inductor to simultaneously provide inductance and power delivery functionality.
Solution Approach 2:
The vertical inductor structure serves multiple functions: it provides the required inductance through its three-dimensional coil configuration, delivers power to other power planes through its through-dielectric via connections, and maintains low resistance through optimal copper thickness. This multi-functional design replaces discrete inductors while enhancing power delivery capability.
3Area of stationary object
If more copper layers are added to increase inductance, then inductance improves, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent segments the inductor into multiple partial turns formed on different dielectric layers, connected by through-dielectric vias to form complete turns. This segmentation allows the inductor to be built incrementally through standard substrate fabrication processes without requiring complex additional steps. Each partial turn can be formed using conventional photolithography and copper deposition, making the overall structure manageable despite its three-dimensional complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient power delivery and scalable inductance without the limitations of thin copper conductors, integrating magnetic materials to compensate for reduced turns and maintain performance.
Implementation Method 1
A magnetic core is disposed within the first full turn of the coil
Implementation Method 2
A first conductor formed on a first dielectric layer as a partial turn of a coil. A second conductor formed on a second dielectric layer that covers the first dielectric layer and first conductor, the second conductor forming a partial turn of the coil
Data Source
AI summary
A method and device includes a first conductor formed on a first dielectric layer as a partial turn of a coil. A second conductor is formed on a second dielectric layer that covers the first dielectric layer and first conductor, the second conductor forming a partial turn of the coil. A vertical interconnect couples the first and second conductors to form a first full turn of the coil. The interconnect coupling can be enhanced by embedding some selective magnetic materials into the substrate.