Embedded Die-to-Die Interconnects for EMI-Robust Multi-Die Modules
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Solution Overview
Problem
Die-to-die interconnects in multi-die modules (MDMs) are susceptible to electromagnetic interference (EMI) due to their external exposure, leading to radiated emissions and susceptibility, which existing shielding solutions complicate and increase costs without addressing all vulnerabilities.
Innovation Solution
Repositioning interconnects and passive components within the package substrate, using embedded capacitors and localized shielding, and modifying signaling architecture to direct-current (DC)-coupled schemes to mitigate EMI.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external shielding is added to protect die-to-die interconnects from EMI, then EMI robustness is improved, but device complexity and cost increase
Solution Approach 1:
The patent extracts the vulnerable interconnects from the external environment by embedding them within the package substrate. This removes the interconnects from direct exposure to EMI sources while maintaining their electrical function, thereby improving EMI robustness without adding external shielding structures.
Solution Approach 2:
The patent nests the communication bus and interconnect traces within the package substrate layers, placing them inside the protective enclosure of the MDM package. This nested configuration provides inherent shielding from external EMI without requiring additional external shielding components.
2Speed
If AC-coupled signaling is used in die-to-die interconnects, then bandwidth is improved, but susceptibility to EMI worsens
Solution Approach 1:
The patent changes the signaling parameter from AC-coupled to DC-coupled architecture. This parameter change eliminates the AC coupling capacitors that act as EMI antennas while maintaining the high bandwidth capability through direct DC coupling between dies, thus improving EMI robustness without sacrificing speed.
3Reliability
If passive components are placed externally for AC coupling, then signal coupling is improved, but EMI exposure increases
Solution Approach 1:
The patent extracts the AC coupling capacitors from external placement and removes them entirely by transitioning to DC coupling. This eliminates the external passive components that would expose the system to EMI while maintaining signal integrity through direct electrical connection.
Solution Approach 2:
The patent merges the coupling function directly into the die-to-die interconnect structure through DC coupling, eliminating the need for separate passive coupling components. This integration removes the EMI vulnerability associated with external capacitors while preserving the signal coupling function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances EMI robustness by reducing EMI coupling into interconnects, preserving signal integrity, and maintaining system performance without additional complexity or cost.
Implementation Method 1
the package substrate is configured to attenuate electromagnetic interference (EMI) incident upon at least one of the first IC die or the second IC die, to reduce or prevent the EMI from coupling into the communication bus
Data Source
AI summary
A system and method of improving electromagnetic compatibility robustness of die-to-die interconnects within MDMs operating in environments susceptible to EMI. The method includes providing a package substrate. The method includes disposing a first integrated circuit (IC) die on a top side of the package substrate. The method includes disposing a second IC on the top side of the package substrate. The method includes enclosing the first IC die and the second IC die with a molding component. The method includes embedding a communication bus within the package substrate and electrically coupling the communication bus between the first IC die and the second IC die. The method includes configuring the package substrate to attenuate EMI incident upon at least one of the first IC die or the second IC die, to reduce or prevent the EMI from coupling into the communication bus.