Embedded-Component Interposer Layout for Low-Noise Signal Routing
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Solution Overview
Problem
Noise interference in signals passing through wiring between components mounted on an interposer and those inside the interposer is a significant issue, particularly when the connection length between the IC and matching circuits or decoupling capacitors is long.
Innovation Solution
An interposer design with a first component exposed or connected to the second surface via a conductor, sealed by a resin layer, significantly shortening the wiring distance and reducing noise mixing, featuring a coreless substrate and a sealing resin layer to minimize noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the wiring length between IC and matching circuit or decoupling capacitor is increased, then the ease of layout and connection is improved, but noise interference in signals increases
Solution Approach 1:
The patent utilizes the thickness direction (Z-axis) of the interposer substrate to route wiring, transforming a 2D layout problem into a 3D solution. By extending wiring through the thickness of the interposer, the horizontal wiring length on the surface is reduced while providing additional routing space in the vertical dimension, thereby reducing noise interference while maintaining layout flexibility
Solution Approach 2:
The patent embeds wiring layers and components within the interposer substrate structure itself, nesting the electrical connections inside the interposer rather than routing them externally. This internal nesting of wiring paths reduces the exposed wiring length and minimizes noise coupling while maintaining ease of connection between IC and matching circuits
2Reliability
If the thickness of the interposer is increased to accommodate components, then the functionality and noise shielding is improved, but the wiring length between mounted components and interposer components increases
Solution Approach 1:
The patent positions components and wiring layers at different heights within the interposer thickness, utilizing the vertical dimension to reduce horizontal wiring distances. By stacking functional layers in the thickness direction, the patent achieves effective noise shielding through increased separation between signal paths while maintaining short connection lengths through vertical vias and conductors
Solution Approach 2:
The patent introduces conductor layers and through-electrodes as intermediary elements that bridge components mounted on the interposer surface with components embedded within the interposer. These conductors provide direct electrical pathways through the interposer thickness, eliminating the need for long external wiring while maintaining noise shielding benefits of the thicker interposer structure
Data Source
AI summary
An interposer has a first surface as a mounting surface and a second surface where an object is to be mounted, the second surface being opposite to the first surface, and the interposer includes: a first component that is exposed directly on the second surface or connected to the second surface via a conductor, the first component being included inside the interposer and located at a position closer to the second surface than to the first surface; and a sealing resin layer that seals the first component.