Embedded LED Package Resin Carrier Layer Optical Absorption
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Solution Overview
Problem
Conventional LED packages are costly due to die-level processing and suffer from reduced light efficiency due to exposed sidewalls that absorb light, necessitating a method to reduce packaging costs and enhance light output.
Innovation Solution
A novel LED package with LEDs and electrical conductors embedded in a resin carrier layer, allowing for wafer-level processing and minimizing exposed sidewalls through a fabrication method that includes applying an epoxy molding compound and forming a redistribution layer for electrical connections, which also reduces the need for silicone encapsulant and enhances thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If die-level processing is used to fabricate LED packages, then packaging precision and reliability are improved, but manufacturing cost increases significantly
Solution Approach 1:
The patent segments the LED substrate into multiple individual LED dies that can be processed separately on the wafer and then reassembled. This allows wafer-level processing for cost efficiency while maintaining die-level precision for each individual LED die through selective bonding and embedding in the resin carrier layer
Solution Approach 2:
The patent performs preliminary actions by bonding LED dies to the resin carrier layer before final packaging completion. The resin carrier layer is prepared in advance with bonding pads and structural features, allowing LED dies to be attached and positioned prior to molding, thereby enabling wafer-level processing while ensuring die-level precision
2Ease of manufacture
If conventional packaging with exposed sidewalls is used, then manufacturing simplicity is maintained, but light extraction efficiency deteriorates due to optical absorption
Solution Approach 1:
The patent extracts the problematic exposed sidewalls by embedding the LED dies within the resin carrier layer. The resin material replaces the air interface and eliminates the exposed substrate sidewalls that cause light absorption, while the bonding pads and electrical connections are extracted to the top surface for wiring
Solution Approach 2:
The patent applies local quality by using different materials in different regions: the resin carrier layer provides optical transparency and mechanical support where light extraction is critical, while metal bonding pads provide electrical connectivity where conductivity is needed, and the LED die substrate provides structural integrity where required
3Loss of energy
If more silicone encapsulant is used to protect LED sidewalls, then light absorption is reduced, but material cost and device volume increase
Solution Approach 1:
The patent extracts the need for excessive silicone encapsulant by embedding LED dies in the resin carrier layer, which already provides the necessary optical and mechanical environment. The resin carrier layer itself serves as the encapsulation medium, eliminating the need for additional silicone domes or encapsulants
Solution Approach 2:
The resin carrier layer performs multiple functions simultaneously: it provides mechanical support for the LED dies, serves as an optical medium for light extraction, provides electrical insulation, and eliminates the need for separate encapsulation materials. This multi-functionality reduces both material quantity and device volume
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces packaging costs by up to 30% and improves light extraction efficiency by minimizing optical absorption, achieving up to 85% light extraction efficiency with reduced silicone usage compared to conventional LED packages.
Implementation Method 1
The exposed sidewalls 140a compromise the efficiency of the LED package 100 because they absorb light emitted from the light emitting layer 130
Implementation Method 2
enhances thermal dissipation
Data Source
AI summary
The present disclosure provides a novel light-emitting diode package and corresponding fabrication method for making such a package. The novel LED package comprises a resin carrier layer having a first and second surface. Embedded in the resin carrier layer are at least one electrical conductor and at least one LED. The embedded LED comprises a substrate having a bottom surface that is substantially exposed at the second surface of the resin carrier layer. The embedded LED further comprises a light emitting layer that is substantially exposed at the first surface of the resin carrier layer.