Embedded Light Emitting Device with Uneven Surface for Extraction

The patent applies local quality by creating an uneven surface structure specifically at the light emitting section where light extraction occurs. The uneven portions are localized to the region where light emission happens, allowing enhanced light extraction efficiency and uniformity in that specific area without affecting the overall device size or productivity. This localized structural modification resolves the contradiction by improving optical performance precisely where needed while maintaining the downsized device configuration.

The patent employs composite materials by combining the semiconductor light emitting element with a resin sealant that has specific mechanical and thermal properties. The resin sealant forms a composite structure with the light emitting element, providing both mechanical strength and heat dissipation capability. This composite approach allows simplified manufacturing processes while maintaining structural integrity and thermal management, as the resin material can be applied in a single step that simultaneously provides sealing, mechanical support, and heat dissipation functions.