Embedded Magnetic Inductor Array for On-Package Voltage Regulator
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Solution Overview
Problem
The challenge in electronic system design is to meet size constraints while maintaining robustness and cost-effectiveness, as traditional inductive circuit elements require significant spacing, leading to increased costs and reduced robustness in smaller, more complex electronic circuit assemblies.
Innovation Solution
The use of air core inductors with magnetic dielectric materials, such as high resistivity magnetic particle polymer composite resin, integrated into the electronic package substrate, allowing for higher inductance values and improved performance by embedding inductive circuit elements with conductive traces and magnetic cores, which reduces size and enhances scalability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If traditional inductive circuit elements are used, then inductance function is achieved, but device area and spacing requirements increase
Solution Approach 1:
The patent combines the inductor with the electronic package substrate by embedding conductive traces and magnetic cores directly into the substrate structure. This merging eliminates the need for separate inductor components and reduces overall device area while maintaining functional robustness through integrated construction.
Solution Approach 2:
The patent transitions from planar inductor designs to three-dimensional embedded structures within the substrate. By utilizing vertical space and multiple substrate layers, the inductor achieves higher inductance values in a smaller footprint, effectively moving the solution into the third dimension.
2Volume of stationary object
If inductor spacing requirements are reduced, then device size decreases, but manufacturing complexity and cost increase
Solution Approach 1:
By merging the inductor fabrication process with the substrate manufacturing process, the patent enables simultaneous production of both components. This integration simplifies manufacturing by eliminating separate inductor assembly steps and reduces overall production complexity despite the advanced embedded structures.
3Reliability
If inductance is scaled up, then performance improves, but performance degradation occurs due to size constraints
Solution Approach 1:
The patent employs composite magnetic materials with high permeability to achieve higher inductance values in smaller areas. The composite structure combines magnetic particles embedded in a polymer matrix, providing enhanced magnetic properties that allow increased inductance without proportional increases in physical footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables smaller electronic packaging with improved inductance values, reducing performance degradation as inductance is scaled, while maintaining robustness and cost-effectiveness by integrating inductive circuit elements with magnetic dielectric materials and conductive traces within the substrate.
Implementation Method 1
The coil core includes the magnetic dielectric material
Implementation Method 2
high resistivity magnetic particle polymer composite resin
Data Source
AI summary
An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.