Embedded Magnetic Inlay Coil Structure for Dense Reliable Component Carriers

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Solution Overview

Problem

Efficiently connecting magnetic components to component carriers is challenging, particularly in ensuring mechanical robustness and electrical reliability under harsh conditions, especially with increasing miniaturization and the number of components with closely spaced contacts.

Innovation Solution

A component carrier is designed with a stack of electrically conductive and insulating layer structures, embedding a magnetic inlay surrounded by an electrically conductive coil structure formed from the conductive layer structures, using a sticky layer for precise positioning and adhesive materials for secure embedding, allowing for compact and accurately aligned components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If magnetic components are connected to component carriers with increasing miniaturization and closely spaced contacts, then product functionalities and component density are improved, but mechanical robustness and electrical reliability deteriorate under harsh conditions

Engineering Contradiction:

Improvecomponent densityVSAvoidelectrical reliability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent combines the magnetic component and coil structure into a single integrated unit by embedding the magnetic inlay directly within the component carrier stack. The coil structure is formed using the conductive layer structures of the component carrier itself, merging what would traditionally be separate components into one unified structure. This integration maintains electrical reliability while achieving high component density.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The magnetic inlay is embedded within the stack of conductive and insulating layer structures, with the coil structure surrounding it. This nested configuration places the magnetic component inside the component carrier while the coil wraps around it, creating a compact integrated structure that achieves high density without compromising reliability.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Productivity

Engineering Contradiction:

Improvecomponent densityVSAvoidmechanical robustness

Core Design Contradiction:

ProductivityVSStrength

Solution Approach 1:

By merging the magnetic component and coil into a single integrated structure embedded in the component carrier, the invention eliminates separate connection interfaces that would be vulnerable to mechanical stress. The unified structure maintains mechanical robustness while achieving high component density.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The magnetic inlay is embedded and the coil structure is formed around it during the component carrier manufacturing process itself, before the component carrier is subjected to harsh conditions or assembly. This preliminary integration ensures mechanical robustness is built into the structure from the outset.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If additional materials are used for embedding magnetic components, then secure positioning and reliable connection are improved, but manufacturing complexity and material usage increase

Engineering Contradiction:

Improveconnection reliabilityVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The conductive layer structures of the component carrier serve dual functions: they form the electrical connections for the circuit and simultaneously create the coil structure surrounding the magnetic inlay. This multi-functionality eliminates the need for separate coil materials and simplifies manufacturing while ensuring reliable connections.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The component carrier's own conductive materials are used to create the coil structure, allowing the component carrier to provide its own connection and coil functionality without requiring additional specialized materials or complex assembly processes.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the manufacture of component carriers with high mechanical and electrical reliability, supporting harsh conditions while maintaining low manufacturing effort and minimizing additional material usage, ensuring precise alignment and efficient electromagnetic interaction.

Implementation Method 1

a magnetic inlay embedded in the stack, wherein the electrically conductive layer structures form at least part of an electrically conductive coil structure surrounding at least part of the magnetic inlay

Methodology Applied

Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS11792932B2Component carrier with embedded magnetic inlay and integrated coil structure

Publication Date: 2023.10.17 AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AG

AI summary

A method of manufacturing a component carrier includes providing a stack with electrically conductive layer structures and at least one electrically insulating layer structure, embedding a magnetic inlay in the stack, and forming an electrically conductive coil structure at least partially based on the electrically conductive layer structures and surrounding at least part of the magnetic inlay.