Embedded MicroLED Waveguides for Low-Power Optical Coupling
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Solution Overview
Problem
Current optical communication systems face challenges in achieving high-density and low-power chip-to-chip connections due to the limitations of traditional integrated circuits and the inefficiencies in coupling microLEDs with waveguides, leading to reduced performance and increased power consumption.
Innovation Solution
The integration of microLEDs with waveguides using a substrate-based optical coupling arrangement, including a microLED with an active layer, a reflector, and a lens within the waveguide, optimized for efficient light reflection and propagation, along with encapsulant materials and curved surfaces to enhance light extraction efficiency and coupling into waveguides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If microLEDs are coupled with waveguides using traditional methods, then light coupling efficiency is limited, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges the microLED active layer directly with the waveguide structure by embedding the active layer within the waveguide material during fabrication. This integration eliminates the need for separate coupling components and interfaces, thereby improving light coupling efficiency while reducing device complexity and manufacturing difficulty.
Solution Approach 2:
The microLED active layer is nested within the waveguide structure, with the active layer positioned inside the waveguide material. This nested configuration allows direct optical coupling without external interfaces, improving efficiency while simplifying the overall device architecture.
2Adaptability or versatility
If chip-to-chip connections are used instead of on-chip connections, then functionality can be increased, but power consumption and connection density requirements increase
Solution Approach 1:
The patent replaces traditional electrical chip-to-chip connections with optical interconnects using microLEDs and waveguides. This substitution enables higher functionality and data transmission capabilities while reducing power consumption, as optical signals can carry more information with lower energy loss compared to electrical signals over chip-to-chip interfaces.
3Productivity
If transistor dimensions are shrunk to increase transistor counts, then IC performance improves, but manufacturing yield decreases and per-transistor costs increase
Solution Approach 1:
The patent substitutes traditional transistor-based electronic interconnects with optical interconnects using microLEDs. This replacement enables high-density connections without the manufacturing yield penalties associated with further transistor shrinkage, as the optical components can be fabricated at larger dimensions with better yield characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables high-density, low-power optical interconnects between chips and chiplets, improving the efficiency of light coupling and reducing energy consumption while maintaining high performance.
Implementation Method 1
a reflector on at least a portion of the waveguide, the reflector positioned to reflect light from the microLED down an axis of the waveguide
Implementation Method 2
a lens within the waveguide, in an optical path of the light from the microLED
Data Source
AI summary
A microLED may be used to generate light for intra-chip or inter-chip communications. The microLED, or an active layer of the microLED, may be embedded in a waveguide. The waveguide may include a lens.