Embedded MLCC Terminal Electrode Layout for Uniform Board Packaging

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Solution Overview

Problem

Conventional multi-layer ceramic capacitors embedded in circuit boards face complexity in the packaging process due to large surface roughness and poor thickness uniformity of terminal electrodes, leading to reduced connection reliability and decreased packaging yield.

Innovation Solution

The embedded multi-layer ceramic capacitor features internal electrodes with specific configurations and electroplated terminal electrodes, allowing for direct formation of wires on the ceramic body surface, simplifying the packaging process and enhancing yield by eliminating steps like insulating layer formation and conductive material filling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional terminal electrode formation method (coating molten metal and plating) is used, then terminal electrodes can be formed on multi-layer brick, but the terminal electrodes exhibit large surface roughness and poor thickness uniformity

Engineering Contradiction:

Improveterminal electrode formationVSAvoidsurface roughness and thickness uniformity

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by pre-forming smooth, uniformly thick terminal electrodes directly on the multi-layer brick during the capacitor manufacturing process, before embedding. This eliminates the need for subsequent molten metal coating and plating operations that cause surface roughness and thickness non-uniformity. The terminal electrodes are prepared in advance with controlled geometry and material properties, ensuring high connection reliability when embedded in the circuit board.

Inventive Principle:

Principle #10Preliminary action

2Reliability

If conventional embedding process (forming insulating layer, drilling holes, filling conductive material) is used, then multi-layer ceramic capacitor can be embedded in circuit board, but the process becomes complicated with multiple steps

Engineering Contradiction:

Improveconnection reliabilityVSAvoidpackaging process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the complex intermediate steps of conventional embedding by using terminal electrodes that are already formed with appropriate geometry and material properties. Instead of forming an insulating layer, drilling holes, and filling conductive material, the pre-prepared terminal electrodes are directly mounted and connected on the circuit board surface, simplifying the packaging process while maintaining connection reliability.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The terminal electrodes are prepared in advance with smooth surfaces and uniform thickness during capacitor manufacturing, eliminating the need for subsequent insulating layer formation, hole drilling, and conductive material filling operations. This preliminary preparation of terminal electrodes with optimal properties for direct mounting significantly reduces packaging process complexity.

Inventive Principle:

Principle #10Preliminary action

3Ease of manufacture

If terminal electrodes with large surface roughness and low thickness uniformity are used, then conventional manufacturing method is simpler, but connection reliability between terminal electrodes and vias is reduced

Engineering Contradiction:

Improveterminal electrode manufacturingVSAvoidconnection reliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent applies preliminary action by forming terminal electrodes with smooth surfaces and uniform thickness directly on the multi-layer brick during capacitor manufacturing, before embedding. This pre-preparation ensures optimal connection reliability when the terminal electrodes are connected to vias on the circuit board, eliminating the need for subsequent molten metal coating and plating that cause surface roughness and thickness non-uniformity.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces packaging complexity and increases yield by ensuring high-quality, uniformly thick terminal electrodes, facilitating direct wire connection and oxidation protection, thereby improving connection reliability.

Implementation Method 1

The first terminal electrode extends to cover the top surfaces of the second portions of the first internal electrodes. The second terminal electrode extends to cover the top surfaces of the second portions of the second internal electrodes.

Methodology Applied

Scientific EffectElectroplating: Electroplating

Data Source

PatentUS20250322991A1Embedded multi-layer ceramic capacitor

Publication Date: 2025.10.16 YAGEO CORP

AI summary

An embedded multi-layer ceramic capacitor includes a multi-layer brick, and first and second terminal electrodes. The multi-layer brick includes a ceramic body, and plural first and second internal electrodes. The ceramic body has upper and lower surfaces, and first and second side surfaces opposite to each other. The first and second internal electrodes are embedded in the ceramic body alternately. Each first and second internal electrode includes first and second portions. The first portion extends between the first and second side surfaces, and is spaced apart from the first and second side surfaces, and the upper and lower surfaces. The second portion extends from a portion of a top surface of the first portion to the upper surface. The second portions of the first and second internal electrodes are opposite to each other. The first and second terminal electrodes cover the top surfaces of the second portions.