Embedded Module Sintered Bonding for Dense Semiconductor Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, decreased reliability, relatively low performance, and large package sizes due to inadequate manufacturing methods.
Innovation Solution
The use of a sintering material comprising solder material and metal particles for attachment processes in electronic devices, eliminating or reducing the need for spacers, which allows for higher density packaging, reduced manufacturing costs, improved manufacturing cycle time, and higher power densities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional semiconductor packaging methods are used with spacers, then package size is larger and manufacturing is simpler, but manufacturing cost increases and density decreases
Solution Approach 1:
The patent removes spacers from the packaging process entirely. By using a sintering material that provides inherent viscosity control and self-leveling properties, the need for spacer components is eliminated, reducing part quantity while maintaining bonding uniformity and increasing packaging density.
Solution Approach 2:
The patent modifies the rheological parameters of the bonding material by using a sintering material with specific viscosity characteristics. This parameter change allows the material to maintain uniform bond thickness without spacers, enabling higher density packaging while simplifying the manufacturing process.
2Manufacturing precision
If spacers are used in attachment processes, then bond thickness uniformity is maintained, but manufacturing cost increases and cycle time increases
Solution Approach 1:
The patent eliminates spacers from the attachment process. The sintering material's inherent viscosity and self-leveling properties replace the spacer function, maintaining bond thickness uniformity while reducing manufacturing steps and cycle time.
Solution Approach 2:
The sintering material performs self-leveling and maintains uniform bond thickness through its own rheological properties without requiring external spacer components. This self-service capability reduces manufacturing complexity and accelerates production.
3Ease of manufacture
If conventional reflow processes are used, then manufacturing is simpler, but bond thickness uniformity and planarity deteriorate
Solution Approach 1:
The patent changes the thermal and rheological parameters of the bonding process by using a sintering material instead of conventional reflow soldering. This material maintains appropriate viscosity at processing temperatures, enabling uniform bond thickness and planarity while keeping the manufacturing process relatively simple.
Solution Approach 2:
The patent uses a composite sintering material that combines solder particles with a binder system designed to maintain optimal viscosity characteristics. This composite material provides both the electrical conductivity of solder and the flow control properties needed for uniform bonding without complex processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves higher density packaging, reduces manufacturing costs, improves manufacturing efficiency, and enhances power density while maintaining uniform bond thickness and planarity during sintering.
Implementation Method 1
a sintering material comprising a solder material and metal particles is used for the attachment process
Data Source
AI summary
An electronic device includes an embedded module including a module component comprising a first terminal and a second terminal. A first module substrate is coupled to the first terminal with a first bonding layer and a second module substrate is coupled to the second component terminal with a second bonding layer. A module encapsulant covers the module component and the first and second module substrates. A first device substrate is coupled to the first module substrate and a second device substrate is coupled to the second module substrate. Device terminals are coupled to the module component and a device encapsulant covers the embedded module, the device terminals, and the first and second device substrates. The first bonding layer includes a first sintering material, the second bonding layer includes a second sintering material, and portions of the first device substrate and the device terminals are exposed from the device encapsulant.