Embedded Optical Interposer Layout for Low-Loss Signal Routing

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Solution Overview

Problem

Existing optical and electrical signal integration technologies are limited by the size constraints of optical components and the need for mixed loss waveguides, which hinder efficient signal transmission and processing.

Innovation Solution

An optical interposer is embedded within an interposer, incorporating waveguides and metallization layers for electrical connections, allowing for larger optical component design and ultra-low loss waveguides, with bonding processes ensuring structural integrity and connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If optical components are integrated with electrical components in mixed packages, then signal transmission capability is improved, but size constraints from adjacent dies limit optical component design

Engineering Contradiction:
Improvesignal transmission capabilityVSAvoidoptical component design area
Core Design Contradiction:
Adaptability or versatilityVSArea of moving object

Solution Approach 1:

The patent separates optical components and electrical components into distinct interposers, with the optical interposer dedicated solely to optical waveguides and components, while the electrical interposer handles electrical components. This segmentation removes size constraints imposed by mixed integration and allows each component type to be optimized independently.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a carrier substrate as an intermediary structure that holds both the optical interposer and electrical interposer separately. This mediator enables both types of components to coexist in a single package without direct spatial constraints, allowing independent optimization of optical and electrical components.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If mixed loss waveguides are used for signal transmission, then integration complexity is reduced, but signal transmission loss increases

Engineering Contradiction:
Improveintegration complexityVSAvoidsignal transmission loss
Core Design Contradiction:
Device complexityVSLoss of energy

Solution Approach 1:

The patent divides the signal transmission path into separate optical and electrical domains using dedicated interposers. Optical waveguides on the optical interposer use optimized low-loss materials and structures specifically designed for optical signals, avoiding the compromises required by mixed-loss waveguides that must accommodate both optical and electrical transmission requirements.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent changes the material and structural parameters of waveguides by implementing dedicated optical waveguides on the optical interposer with optimized refractive index profiles, materials, and geometries tailored for minimal optical loss, rather than using generalized mixed-loss waveguide structures.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20250347878A1Optical devices and methods of manufacture
Publication Date: 2025.11.13 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20250347878A1 patent drawing
  • US20250347878A1 patent drawing
  • US20250347878A1 patent drawing

AI summary

Optical devices and methods of manufacture are presented in which optical interposers are embedded within interposers. In some embodiments a method includes embedding an optical interposer into an interposer with one or more waveguides, with or without other semiconductor devices, and then bonding one or more semiconductor devices onto the interposer.