Embedded Component Package Structure Eliminating Molding Compound
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Solution Overview
Problem
Conventional electronic package structures are bulky due to the use of molding compounds, which increases volume and thickness, failing to meet consumer demands for compactness.
Innovation Solution
A package structure featuring a circuit substrate with a build-up structure of patterned circuit layers and dielectric layers, conductive through holes, and embedded electronic components, assembled into a connecting slot, eliminating the need for molding compounds and reducing overall volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging with molding compound is used, then electronic component is protected and contacts are lowered, but package volume and thickness increase
Solution Approach 1:
The patent removes the molding compound from the packaging structure, extracting the harmful element that causes volume increase while maintaining essential protection functions through alternative means such as conformal coating on circuit boards and protective structures on leadframes
Solution Approach 2:
The patent transitions from traditional three-dimensional packaging with molding compound to a more planar, two-dimensional arrangement where components are mounted directly on circuit boards with flattened leadframe structures, reducing vertical thickness and overall package volume
2Reliability
If molding compound is used to package electronic component, then component is protected, but package thickness increases
Solution Approach 1:
The molding compound is completely removed from the packaging structure, eliminating the thickness contribution from this material while maintaining protection through alternative methods such as conformal coatings and structural design
Solution Approach 2:
The patent employs thin film structures such as conformal coatings on circuit boards and thin protective layers on leadframes instead of bulky molding compound, achieving protection with minimal thickness addition
3Reliability
If female socket with space for packaged component is used, then electrical connection is achieved, but overall volume cannot be reduced
Solution Approach 1:
The patent merges the female socket structure with the circuit board assembly, integrating the connection function directly into the package structure rather than requiring a separate socket component, thereby eliminating the space needed for accommodating a traditional socket
Solution Approach 2:
The circuit board serves multiple functions simultaneously: it provides mechanical support for components, establishes electrical connections through its trace patterns, and acts as part of the packaging structure itself, eliminating the need for dedicated socket structures
Data Source
AI summary
A package structure includes a circuit substrate, at least one electronic component, and a connecting slot. The circuit substrate includes at least one core layer, a build-up structure including at least three patterned circuit layers, at least two dielectric layers and conductive through holes, and circuit pads. The electronic component is embedded in at least one of the dielectric layers and located in a disposition area. The electronic component is electrically connected to one of the patterned circuit layers through a portion of the conductive through holes. The connecting slot has a bottom portion, a plurality of sidewall portions connecting the bottom portion, and a plurality of connecting pads located on the sidewall portions. The circuit substrate is assembled to the bottom portion, and the circuit pads are electrically connected to the connecting pads through a bent area of the core layer that is bent relative to the disposition area.