Embedded Connection Pad Alignment in Semiconductor Package
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Solution Overview
Problem
The reliability of electrical connections in semiconductor package structures, particularly in wafer-level packaging, is compromised due to misalignment between conductive terminals and connection pads, leading to reduced yield and increased costs in verification testing and manufacturing processes.
Innovation Solution
A method involving the formation of barrier seed patterns and conductive terminals on a redistribution circuit structure, with precise alignment and exposure of connection pads to enhance electrical connectivity and reliability, utilizing a debond layer for carrier separation and planarization processes to ensure accurate pad exposure and connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wafer-level packaging is used, then manufacturing process is simpler, but electrical connection reliability deteriorates due to misalignment between conductive terminals and connection pads
Solution Approach 1:
The patent applies preliminary action by forming barrier seed patterns and conducting alignment markings on the carrier substrate before bonding the semiconductor wafer. This pre-positioning of alignment features enables precise registration of conductive terminals with connection pads during subsequent processing, thereby ensuring electrical connection reliability without requiring complex real-time alignment mechanisms.
Solution Approach 2:
The patent introduces an intermediary carrier substrate that incorporates alignment markings and barrier seed patterns. This carrier acts as a mediator between the manufacturing process and the final package, providing a stable reference framework that ensures accurate alignment of conductive terminals with connection pads, thus resolving the reliability issue without directly modifying the semiconductor die or final package structure.
2Productivity
If misalignment between conductive terminals and connection pads occurs, then manufacturing cost decreases, but verification testing cost and time increase
Solution Approach 1:
The patent performs preliminary alignment by forming barrier seed patterns and alignment markings before wafer bonding. This pre-alignment ensures that conductive terminals will accurately register with connection pads after dicing, eliminating the need for time-consuming verification testing to detect misalignment issues and thereby reducing both testing time and associated costs.
Solution Approach 2:
The patent incorporates alignment markings that provide visual feedback during the bonding and dicing processes. These markings enable operators to verify alignment accuracy in real-time, allowing for immediate correction if deviations are detected, thus preventing misalignment-related rework and reducing verification testing requirements.
3Reliability
If barrier seed patterns are formed with precise alignment, then electrical connectivity improves, but manufacturing process complexity increases
Solution Approach 1:
The patent forms barrier seed patterns with integrated alignment markings on the carrier substrate before bonding the semiconductor wafer. This preliminary formation of precisely aligned barrier seed patterns ensures that subsequent conductive terminal formation will achieve accurate electrical connectivity without requiring complex real-time alignment systems or multiple processing steps.
Data Source
AI summary
A package structure includes a semiconductor die, a redistribution circuit structure, and a connection pad. The redistribution circuit structure is located on and electrically connected to the semiconductor die. The connection pad is embedded in and electrically connected to the redistribution circuit structure, and the connection pad includes a barrier film and a conductive pattern underlying thereto, where a surface of the barrier film is substantially leveled with an outer surface of the redistribution circuit structure.