Embedded Passive Element Semiconductor Package for Thermal Radiation
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Solution Overview
Problem
Existing semiconductor packages face challenges in efficiently managing thermal radiation, which becomes critical due to increased power consumption and heat generation in high-speed and high-capacity electronic devices.
Innovation Solution
The semiconductor package incorporates a substrate with a chip structure, a passive element structure including a passive element and a resilient insulator, and a stiffening structure that overlaps the passive element structure, enhancing thermal radiation through the combination of these components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the passive element structure is placed on the substrate surface, then the manufacturing process is simpler, but the package size increases and warpage risk increases
Solution Approach 1:
The passive element structure is embedded within a cavity formed in the substrate, nesting the passive element inside the substrate volume rather than placing it on the surface. This reduces the external package dimensions while maintaining all necessary functional components within the substrate's internal space.
Solution Approach 2:
The passive element structure transitions from a surface-level placement (2D arrangement) to an embedded position within the substrate thickness (utilizing the third dimension). The cavity provides vertical space within the substrate, allowing the passive element to be positioned at a lower level than the substrate top surface, thereby reducing the horizontal footprint and overall package size.
2Ease of manufacture
If the passive element structure is placed on the substrate surface, then the assembly process is simpler, but thermal radiation efficiency decreases
Solution Approach 1:
Embedding the passive element structure within the substrate cavity positions it closer to the substrate's thermal management structures and allows for better thermal coupling with heat dissipation pathways, improving overall thermal radiation efficiency.
Solution Approach 2:
The resilient insulator material serves as a thermal intermediary between the passive element and the substrate cavity walls, facilitating efficient heat transfer from the passive element to the substrate's thermal management system while providing mechanical cushioning.
3Stability of the object's composition
If a stiffening structure is added to reduce warpage, then structural stability improves, but device complexity increases
Solution Approach 1:
The stiffening structure is merged with the existing substrate and passive element structure, forming an integrated assembly where the stiffening function is achieved through the combined geometry and material properties of the substrate-cavity-passive element-stiffening structure system rather than adding a completely separate component.
Solution Approach 2:
The stiffening structure serves multiple functions: it provides mechanical support to prevent warpage, acts as a thermal management component, and contributes to the overall structural integrity of the package. This multi-functionality reduces the need for additional dedicated components.
Data Source
AI summary
A semiconductor package may comrpise a substrate, a chip structure on the substrate, a passive element structure in the substrate and including a passive element, and a stiffening structure at least partially overlapping the passive element structure. A top surface of the passive element may be below a top surface of the substrate.