Embedded Power Device Assemblies in Cold Plate Substrates
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Solution Overview
Problem
Power electronic devices, particularly those using silicon-carbide, face challenges in compact packaging due to increased heat flux, requiring improved cooling solutions while maintaining a small footprint.
Innovation Solution
The integration of a cold plate assembly with a heat sink and direct bonded metal (DBM) substrates, where power devices are embedded in substrate cavities, allowing for efficient heat dissipation and electrical coupling without additional conductive components, reducing overall thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If power electronic devices are made compact with smaller footprint, then device size is reduced, but heat flux increases and cooling becomes more difficult
Solution Approach 1:
The patent merges the power device assembly directly with the cold plate assembly by embedding the power device into the cold plate substrate. This integration eliminates separate mounting structures and reduces thermal resistance interfaces, enabling efficient heat dissipation from the power device directly into the cold plate's cooling channels, thus resolving the cooling difficulty caused by compact design
Solution Approach 2:
The patent introduces a thermal interface material as an intermediary between the power device and the cold plate substrate. This intermediary ensures optimal thermal contact and heat transfer while accommodating slight dimensional variations, effectively managing the heat flux generated by the compact power device
2Temperature
If conventional cooling solutions are added to power devices, then cooling capability is improved, but package size increases
Solution Approach 1:
The cooling function is merged directly into the substrate structure of the cold plate assembly. The substrate itself serves as both the mechanical support and the thermal management component, with cooling channels integrated within the substrate. This eliminates the need for separate cooling brackets or attachments, maintaining compact package size while providing effective cooling
Solution Approach 2:
The cold plate substrate performs multiple functions simultaneously: it provides mechanical support for the power device, serves as a thermal pathway for heat dissipation, and acts as a structural component of the overall assembly. This multi-functionality eliminates the need for additional dedicated cooling components, keeping the package size compact
3Reliability
If additional conductive components are used for electrical coupling, then electrical connection is improved, but thermal resistance increases
Solution Approach 1:
The electrical coupling function is merged with the substrate structure itself. The substrate contains embedded conductive pathways that provide both mechanical support and electrical connection. This integration eliminates separate conductive components and their associated thermal resistance interfaces, achieving low thermal resistance while maintaining reliable electrical coupling
Solution Approach 2:
The substrate is constructed as a composite structure with embedded conductive elements within an electrically insulating but thermally conductive matrix. This composite design provides both electrical coupling and thermal management functions through a single integrated component, reducing the number of interfaces and overall thermal resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances cooling efficiency, enables higher power output, and maintains a compact package size by minimizing thermal resistance and assembly tolerances, allowing for direct PCB printing on the cold plate.
Implementation Method 1
The DBM substrate includes a first metal layer directly bonded to an insulator layer... enhancing cooling efficiency... by minimizing thermal resistance
Implementation Method 2
The cold plate assembly includes a manifold including a heat sink cavity in a first surface and a heat sink... positioned in the heat sink cavity
Data Source
AI summary
Disclosed herein are apparatus and methods for a power electronics assembly includes a cold plate assembly and one or more power device assemblies. The cold plate assembly includes a manifold including a heat sink cavity in a first surface and a heat sink. The heat sink includes one or more substrate cavities and the heat sink is positioned in the heat sink cavity. The one or more power device assemblies are positioned within the one or more substrate cavities. Each power device assembly of the one or more power assemblies includes a direct bonded metal (DBM) substrate including a first metal layer directly bonded to an insulator layer and a power device. The DBM substrate includes a power device cavity. The power device is positioned in the power device cavity and the power device is electronically coupled to the first metal layer.