Embedded Temperature Compensation Resonator Structure

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Solution Overview

Problem

Existing resonator structures face inaccuracies in temperature compensation due to temperature compensation elements being disposed on the outer wall, leading to errors in temperature determination and compensation, especially in sophisticated electronic products.

Innovation Solution

An active type temperature compensation resonator structure with a temperature compensation element embedded within the resonant body, featuring a temperature sensing unit and a temperature controlling unit, allowing for precise temperature reflection and dynamic current adjustment to maintain the resonant body within a suitable temperature interval.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the temperature compensation element is disposed on the outer wall of the resonant body, then the structure is easier to manufacture, but the temperature measurement precision deteriorates due to insulation requirements and inaccurate temperature reflection

Engineering Contradiction:

Improveease of manufactureVSAvoidtemperature measurement precision

Core Design Contradiction:

Ease of manufactureVSMeasurement precision

Solution Approach 1:

The temperature compensation element is merged with the resonant body by embedding it directly into the resonant body structure. This integration eliminates the need for separate mounting structures and insulation pads, allowing the temperature compensation element to directly sense the resonant body's temperature while maintaining manufacturing feasibility through integrated fabrication processes.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The temperature compensation element is nested within the resonant body structure. This nesting approach allows the temperature compensation element to be positioned inside or within the structural boundaries of the resonant body, enabling direct thermal contact and accurate temperature sensing without requiring external mounting that would compromise measurement precision.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Measurement precision

If the temperature compensation element is embedded in the resonant body, then the temperature measurement precision is improved, but the manufacturing complexity increases

Engineering Contradiction:

Improvetemperature measurement precisionVSAvoiddevice complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The temperature compensation element and resonant body are merged into a single integrated structure. This merging reduces device complexity by eliminating separate components, mounting mechanisms, and insulation elements. The integrated design allows both the resonant body and temperature compensation element to be fabricated together using compatible manufacturing processes, simplifying the overall device architecture while achieving precise temperature sensing.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables accurate temperature compensation, significantly reducing frequency drifting by directly embedding the temperature compensation element within the resonant body, ensuring precise temperature reflection and control.

Implementation Method 1

has a specified temperature coefficient of resistance to reflect temperature of the resonant body

Methodology Applied

Scientific EffectTemperature coefficient of resistance: Thermo-resistive Effect

Implementation Method 2

for a compensated current to pass therethrough

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS9899987B2Active type temperature compensation resonator structure

Publication Date: 2018.02.20 NATIONAL TSING HUA UNIVERSITY

AI summary

An active type temperature compensation resonator structure is provided, including a resonant body and a temperature compensation element embedded in the resonant body for a compensation current to pass therethrough. The temperature compensation element has a specified temperature coefficient of resistance that reflects the temperature of the resonant body. The magnitude of the compensated current corresponds to the reflected temperature of the resonant body. With the active type temperature compensation resonator structure, the temperature of the resonant body can be accurately reacted by the specified temperature coefficient of resistance, such that the temperature compensation element, through which the compensated current passes, can dynamically correspond to the temperature of the resonant body and accurately provide the resonant body with temperature compensation.