Embedded RF Package with In-Situ Shielding
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Solution Overview
Problem
Semiconductor device packages face challenges in reducing their form factor dimensions (x, y, and z) due to the space requirements for active and passive components, which also lead to increased electromagnetic interference (EMI) as switching speeds increase.
Innovation Solution
Embedding an active die within an electromagnetically shielded cavity in the core layer of the package substrate and partially or fully embedding a crystal oscillator within the core layer, reducing the package's form factor dimensions and using in-situ electromagnetic shielding to minimize EMI.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple components are incorporated into a single package to reduce system board space, then the package x-y dimensions and z-height are reduced, but electromagnetic interference increases due to increased switching speeds and reduced dimensions
Solution Approach 1:
The patent embeds multiple components including active dies, crystal oscillators, and passive components within a single package substrate, nesting them in a hierarchical arrangement where smaller components are integrated within the larger package structure. This nesting approach reduces the overall x-y footprint while implementing EMI shielding layers between components to mitigate electromagnetic interference generated by the closely spaced high-speed switching components.
Solution Approach 2:
The patent introduces EMI shielding layers as intermediary structures between active components that generate electromagnetic interference and sensitive components. These shielding layers act as mediators that block or redirect electromagnetic fields, allowing multiple components to be closely integrated within the reduced package dimensions without suffering from excessive EMI. The shielding layers are strategically positioned between the RF die, baseband die, and crystal oscillators.
2Volume of moving object
If package dimensions are reduced to meet ultrabook and smartphone requirements, then the form factor is minimized, but electromagnetic emissions increase requiring additional EMI reduction strategies
Solution Approach 1:
The patent implements a nested structure where EMI shielding cavities and shielding layers are integrated within the compact package volume. Multiple shielding layers are nested between different functional blocks (RF section, baseband section, crystal oscillator) to contain electromagnetic emissions within the reduced package volume, preventing emissions from propagating outward while maintaining the minimized form factor required for ultrabooks and smartphones.
Solution Approach 2:
The patent applies EMI shielding selectively in specific local regions where electromagnetic interference is most problematic. Rather than enclosing the entire package in a single large shield, the patent implements localized shielding cavities and shielding layers around specific high-emission components such as the RF die and crystal oscillators. This local quality approach reduces overall package volume while effectively containing emissions from critical components.
3Volume of moving object
If active die is embedded within electromagnetically shielded cavity in core layer, then package form factor is reduced in all dimensions, but manufacturing complexity increases
Solution Approach 1:
The patent segments the package substrate into distinct functional regions including RF sections, baseband sections, and crystal oscillator sections, with EMI shielding cavities strategically positioned in the core layer to contain each segment. This segmentation allows the active dies to be embedded at optimized positions within their respective shielded cavities, reducing the overall package form factor while organizing the complex multi-component integration into manageable functional blocks that can be manufactured using standardized PCB fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for a reduced form factor in all dimensions while effectively mitigating electromagnetic noise, improving system performance by shortening interconnects and reducing the impact of taller components on package height.
Implementation Method 1
an in-situ electromagnetic shield formed on all the sidewalls of the cavity
Data Source
AI summary
A semiconductor device package having reduced form factor and a method for forming said semiconductor device are disclosed. In an embodiment, an active die is embedded within a cavity in the core layer of the package substrate, wherein an in-situ electromagnetic shield is formed on the sidewalls of the cavity. In another embodiment, a crystal oscillator is at least partially embedded within the core layer of the package substrate. In another embodiment, a package having a component embedded in the core layer is mounted on a PCB, and a crystal oscillator generating a clock frequency for the package is mounted on the PCB. By embedding components within the core or removing components from the package to be mounted directly on the PCB, the x, y, and z dimensions of a package may be reduced. In addition, in-situ electromagnetic shield may reduce EM noise emitted from the active die.