Embedded Semiconductor Circuit Board Thermal Strain Management
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Solution Overview
Problem
Semiconductor devices embedded in organic substrates are prone to cracking under thermal strain in high-temperature environments, while inorganic substrates offer better thermal stability but are fragile, requiring a joining structure to prevent cracking during high-density mounting.
Innovation Solution
A multilayer circuit board with inorganic material-based insulating substrates and heat-resistant adhesive layers, where a semiconductor device is embedded in a penetrative portion of the substrate, using thermoplastic and thermosetting resins to reduce thermal strain and enhance adhesion, and formed using etching to prevent cracking during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an organic substrate is used to embed a semiconductor device, then the substrate is easier to manufacture and less fragile, but cracking occurs under thermal strain in high-temperature environments
Solution Approach 1:
The patent employs an organic substrate composed of multiple layers with different material properties. The first insulating substrate layer (31) has a coefficient of thermal expansion matching the semiconductor device (20), while the second insulating substrate layer (32) provides mechanical strength. This composite structure allows the substrate to withstand thermal strain without cracking while maintaining ease of manufacturing through standardized multi-layer PCB fabrication processes.
2Stability of the object's composition
If an inorganic substrate is used to reduce thermal expansion and improve dimensional stability, then thermal stability is improved, but the substrate becomes more fragile and requires additional joining structures to prevent cracking
Solution Approach 1:
The patent applies local quality by creating an embedment portion (33) with specific mechanical properties within the inorganic substrate. This embedment portion has a coefficient of thermal expansion that matches the semiconductor device, providing localized thermal compatibility where the device is mounted. The rest of the inorganic substrate maintains its high dimensional stability and low thermal expansion properties, achieving both thermal stability and crack prevention through spatially differentiated material properties.
3Productivity
If high-density mounting is implemented to increase data transmission capacity, then data transmission capability is improved, but heat generation increases and thermal strain cracking risk increases
Solution Approach 1:
The patent addresses thermal management by carefully selecting and controlling the coefficient of thermal expansion parameter of the substrate layers. The first insulating substrate layer is designed with a CTE that matches the semiconductor device, creating a thermal parameter match that minimizes thermal strain during high-density operation. This parameter optimization allows the system to handle increased heat generation from high-density mounting without causing cracking.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a circuit board with a built-in semiconductor device that prevents cracking and maintains reliability over a wide temperature range, suitable for high-density mounting and optical interconnection, accommodating increased data transmission and heat generation in information communication devices.
Implementation Method 1
thermal strain during curing is reduced, preventing cracking in forming a laminate
Implementation Method 2
a resin component having a softening point lower than the softening point of the thermoplastic resin
Data Source
AI summary
An object is to provide a circuit board that includes a built-in semiconductor device and has a configuration that prevents cracking and has excellent reliability in operation over a wide temperature range. As a solution, a circuit board (10A) has a configuration in which a first insulating substrate (1) is laminated on a second insulating substrate (2) while interposing a first adhesive layer (7a), and a semiconductor device (9) is embedded in an embedment portion (1c) formed in the first insulating substrate (1).