Embedded Sensor Package Structure for Ultra-Thin Semiconductor Integration
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Solution Overview
Problem
Current semiconductor device packages are bulky due to encapsulating sensors and processors on a substrate, hindering size reduction and integration in wearable devices.
Innovation Solution
A semiconductor device package design with a carrier, protective element, and embedded sensor device, where the sensor device's surfaces are exposed, allowing for thinner packages and easier integration of multiple devices without grinding, and incorporating a blocking element to strengthen the structure and reduce optical interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sensors and processors are disposed on a substrate and encapsulated to form a sensor package, then the devices are protected and functional, but the package thickness becomes relatively large
Solution Approach 1:
The patent extracts the sensor device from the traditional substrate-based configuration and embeds it directly into the carrier. The sensing portion is positioned to extend through the carrier thickness, with its surface exposed without requiring additional encapsulation layers, thereby reducing overall package thickness while maintaining protection through the carrier structure itself.
Solution Approach 2:
The invention transitions from a planar substrate-based arrangement to a three-dimensional embedded structure. The sensor device is positioned vertically within the carrier with its sensing surface exposed at the top surface, utilizing the Z-dimension (thickness direction) to achieve both protection and thin profile, rather than expanding in the XY-plane.
2Adaptability or versatility
If multiple devices are integrated in a traditional encapsulated configuration, then functionality is enhanced, but the package size increases
Solution Approach 1:
The patent merges multiple devices (sensor device and processing device) into a single integrated package structure where both devices are embedded within the same carrier. The carrier serves as a common housing that protects both devices while allowing their surfaces to be exposed, eliminating the need for separate encapsulation for each device and reducing overall package volume.
Solution Approach 2:
The carrier structure is designed to serve multiple functions simultaneously: it acts as a protective housing for both the sensor and processing devices, provides mechanical support, enables heat dissipation pathways, and allows surface exposure for electrical connections. This multi-functionality reduces the need for additional components and reduces overall package size.
3Reliability
If traditional encapsulation methods are used, then devices are protected from environmental factors, but manufacturing complexity increases due to grinding requirements
Solution Approach 1:
The invention extracts the sensing surface from the encapsulated volume and positions it at the exposed top surface of the carrier. This eliminates the need for post-encapsulation grinding or dicing operations to access the sensing surface, simplifying the manufacturing process while maintaining device protection through the carrier structure.
Data Source
AI summary
A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a protective element, and a sensor device. The protective element encapsulates the carrier. The sensor device is embedded in the carrier and the protective element. The sensor device includes a sensing portion and a protective portion adjacent to the sensing portion, and the protective portion of the sensor device has a first surface exposed from the protective element and the carrier.