Embedded Electromagnetic Shielding in Resin Molded Electronic Devices
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Solution Overview
Problem
Conventional electromagnetic shielding techniques for electronic devices in high frequency bands, such as microwave and millimeter-wave bands, result in increased device size and production costs due to the need for separate metal cases and substrates, limiting the reduction in thickness and flexibility in wiring circuit design.
Innovation Solution
An electronic device with an electromagnetic shield is created using a resin molded body that embeds and fixes both the electronic components and an electrically conductive member, eliminating the need for separate metal cases and allowing for flexible wiring circuit design, achieved through a method involving temporary fixation, resin molding, and additional electromagnetic shielding steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a separate metal case is used to shield electronic components from electromagnetic waves, then electromagnetic shielding effectiveness is improved, but device size and production cost increase
Solution Approach 1:
The patent combines the electromagnetic shielding function with the circuit board structure by providing an electrically conductive circuit pattern on the circuit board that surrounds and shields the electronic component. This merging eliminates the need for a separate metal case, thereby maintaining electromagnetic shielding effectiveness while reducing device size and complexity.
Solution Approach 2:
The circuit board serves multiple functions: it provides mechanical support for the electronic component, establishes electrical connections through soldering, and simultaneously provides electromagnetic shielding through the electrically conductive circuit pattern. This multi-functionality eliminates the need for separate shielding structures.
2Object-affected harmful factors
If a separate metal case is used to shield electronic components, then electromagnetic shielding effectiveness is improved, but production cost increases
Solution Approach 1:
The shielding function is merged into the circuit board manufacturing process itself. The electrically conductive circuit pattern is formed using standard PCB fabrication techniques (copper tracing, solder mask), eliminating the need for separate metal case manufacturing and assembly operations, thereby reducing production cost.
Solution Approach 2:
The circuit board performs multiple functions including mechanical support, electrical connection, and electromagnetic shielding. This eliminates the need for separate metal case components and their associated manufacturing and assembly costs.
3Object-affected harmful factors
If a separate metal case is used for shielding, then electromagnetic shielding effectiveness is improved, but device thickness increases
Solution Approach 1:
The shielding structure is merged into the circuit board itself rather than being a separate external component. The electrically conductive circuit pattern on the circuit board provides shielding without adding the thickness of a separate metal case, thereby enabling thinner device design.
4Object-affected harmful factors
If electronic components are mounted on a circuit board and shielded with a metal case, then electromagnetic shielding is achieved, but assembly complexity increases
Solution Approach 1:
The shielding function is merged into the circuit board structure, eliminating the need to assemble a separate metal case onto the circuit board. The electrically conductive circuit pattern provides shielding as an integrated feature, thereby reducing assembly complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces production costs and enables a thinner, more compact electronic device with greater freedom in designing the wiring circuit while maintaining effective electromagnetic shielding.
Implementation Method 1
an electrically conductive member which electromagnetically shields the at least one electronic component
Data Source
Figure 1(a)~1(b)
Figure 2(a)~2(g)
Figure 3(a)~3(b)
AI summary
The present invention provides an electronic device which includes an electromagnetic shield, can keep down a production cost, can be made to have a reduced thickness, and has a high degree of freedom in designing a wiring circuit. Further, the present invention provides a method for producing such an electronic device. The electronic device (1A) includes at least one high frequency functional component (21), an electrically conductive member (10) which electromagnetically shields the at least one high frequency functional component (21), and a resin molded body (23) in which at least part of the high frequency functional component (21) and at least part of the electrically conductive member (10) are embedded and fixed. Shielding of a first electronic component with respect to a second component is improved by electrically conducting element covering the connecting area between the two components.