Electric Component Embedded Structure Thickness Reduction
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Solution Overview
Problem
The existing electric component embedded structures face challenges in reducing size due to the increased thickness caused by rewiring insulating layers needed for connecting electrode terminals to electric components, which hinders the miniaturization of these structures.
Innovation Solution
The proposed electric component embedded structure features a design where first electrode terminals are connected directly to the wiring on the insulating layer without a rewiring layer, using via-conductors to connect the terminals to the wiring, allowing for a decrease in mounting area without increasing thickness, and includes a second insulating layer with a cavity to accommodate the electric component, reducing overall thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a rewiring insulating layer is provided to prevent first electrode terminals from being connected to electric component electrodes, then the electrical connection is prevented, but the thickness of the structure increases
Solution Approach 1:
The patent removes the rewiring insulating layer from the structure. Instead of using an insulating layer to prevent unwanted electrical connections, the design relies on the natural isolation provided by the first insulating layer and the precise positioning of electrode terminals within the formation area, thereby eliminating the thickness increase caused by additional rewiring layers
Solution Approach 2:
The patent transitions from a planar wiring approach to a three-dimensional stacked structure where electrode terminals are disposed in the formation area of the electric component in the stacking direction. This vertical arrangement allows electrical connection control without requiring additional horizontal insulating layers, thus reducing overall thickness
2Area of stationary object
If the mounting area is decreased by disposing first electrode terminals in the formation area of the electric component, then the size is reduced, but the risk of unwanted electrical connection increases
Solution Approach 1:
The patent applies different functional properties to different regions: the first insulating layer provides electrical isolation in the formation area where electrode terminals are disposed, while allowing connections in other areas. This localized insulation strategy enables compact terminal placement without unwanted electrical connections
Solution Approach 2:
The patent segments the electrode terminals into different functional groups: intra-area terminals disposed in the formation area for compact mounting, and extra-area terminals disposed outside the formation area. This segmentation allows optimized spatial arrangement while maintaining electrical connection integrity through the via-conductor network
3Reliability
If a rewiring layer is added to control electrical connections, then connection reliability is improved, but the device complexity increases
Solution Approach 1:
The patent merges the functions of the first insulating layer and the rewiring insulating layer into a single integrated insulating structure. The first insulating layer simultaneously provides base insulation and prevents unwanted connections in the formation area, eliminating the need for a separate rewiring layer and reducing overall structural complexity
Solution Approach 2:
The first insulating layer serves multiple functions: it provides electrical isolation for the wiring, supports the via-conductors, and prevents unwanted electrical connections between electrode terminals and electric component electrodes. This multi-functional design eliminates the need for dedicated rewiring insulation, simplifying the overall structure
Data Source
AI summary
In an electric component embedded structure, a first electrode terminal provided on a first main surface includes an intra-area terminal, and the intra-area terminal is electrically connected to an overlap portion of an overlap wiring in a formation area of an electric component. Accordingly, a decrease in mounting area of the electric component embedded structure is achieved. The intra-area terminal can be electrically connected to a second electrode terminal provided on a second main surface via a first via-conductor, the overlap wiring, and a second via-conductor. The intra-area terminal is connected to a wiring (an overlap wiring) of a first insulating layer without additionally providing a rewiring layer causing an increase in thickness, and the increase in thickness is curbed, whereby a decrease in size of the electric component embedded structure is achieved.